Integration of BaxSr1-xTiO3 thin films with AlGaN/GaN HEMT circuits

hongtao xu,nadia k pervez,p j hansen,likun shen,stacia keller,u k mishra,robert a york
DOI: https://doi.org/10.1109/EDMO.2003.1260077
IF: 4.8157
2004-01-01
IEEE Electron Device Letters
Abstract:AlGaN/GaN HEMTs have attracted considerable interest as power devices in microwave applications, promising greater than a tenfold increase in power-density as compared with GaAs devices. Similarly, BaxSr1-xTiO3 (BST) thin films have been investigated for microwave circuit application because of their high dielectric constants, high tunability, relatively low loss, and fast switching speed. BST-based varactors are especially attractive for high power RF circuits since they can sustain relatively large AC fields, unlike diode technologies. Additionally due to its high dielectric constant, BST is a candidate for every compact MMIC DC blocking capacitors, promising a 100-fold reduction in capacitor area as compared with SiN and SiO2 capacitors. In this paper, we will provide a valid method of process integration for future active GaN circuit design and fabrication using BST capacitors. A C-band MMIC oscillator in GaN HEMT technology has been designed with BST capacitors as DC blocking capacitors.
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