Suppression of Indium Droplet Formation by Adding CCl4during Metalorganic Chemical Vapor Deposition Growth of InN Films

H. Wang,L. L. Wang,X. Sun,J. H. Zhu,W. B. Liu,D. S. Jiang,J. J. Zhu,D. G. Zhao,Z. S. Liu,Y. T. Wang,S. M. Zhang,H. Yang
DOI: https://doi.org/10.1088/0268-1242/24/7/075004
IF: 2.048
2009-01-01
Semiconductor Science and Technology
Abstract:In this work, the influences of CCl4 on the metalorganic chemical vapor deposition (MOCVD) growth of InN were studied for the first time. It was found that the addition of CCl4 can effectively suppress the formation of metal indium (In) droplets during InN growth, which was ascribed to the etching effect of Cl to In. However, with increasing of CCl4 flow, the InN growth rate decreased but the lateral growth of InN islands was enhanced. This provides a possibility of promoting islands coalescence toward a smooth surface of the InN film by MOCVD. The influence of addition of CCl4 on the electrical properties was also investigated.
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