Preparing aluminum nitride thin film by atomic layer deposition

陈曜,冯俊波,周治平,于军
DOI: https://doi.org/10.3321/j.issn:1671-4512.2009.07.009
2009-01-01
Abstract:Using a sequential injection of trimethylaluminum (TMA) and ammonia (NH 3), aluminum nitride (AlN) thin films were prepared on silicon wafers by atomic layer deposition (ALD). The deposition condition was optimized by characterizing the growth rate, atomic percentage and roughness of the thin films with scan electron microscopy (SEM), energy dispersive spectroscopy (EDS) and atomic force microscopy (AFM) and a unique monomolecular growth mechanism was achieved with growth rate of 0.205 nm/cycle and roughness of 0.69 nm in 61 nm thick films. Finally, by using the conformal property of the ALD AlN thin films, nanoscale annular photonic crystals (APC) were fabricated which avoids thechallenging electron-beam lithography (EBL) alignment to achieve a process accuracy of 50 nm.
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