Study of preparation of AlN Thin Films for FBAR Application by RF Sputtering

董树荣,王德苗
DOI: https://doi.org/10.3969/j.issn.1004-1699.2006.05.039
2006-01-01
Abstract:AlN thin films with high c-axis orientation are deposited by RF reactive magnetron sputtering. Based on the analysis of the Berg hysteresis model, we extend a new control method to quickly depositing AlN thin film with high c-axis oriented. The proposed method identify reactive phases by cathode voltage and control reactive phases by the flow quantity of N 2. Under RF power density 20W/cm 2, high c-axis oriented AlN thin film is deposition at 2. 3μm/h by RF reactive sputtering. The deposition rate is much higher than ever. Through X-ray diffraction (XRD) analysis, the full width at half maximum (FWHM) of AlN (002) is about 0. 3°, which is shown a high c-axis orientation of AlN thin film by (002).
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