Abstract:It is challenging to grow aluminum nitride (AlN) in c-axis orientation on a metal electrode, primarily due to lattice mismatch and the difference between the coefficients of thermal expansion. In this work, we investigate and optimize the effects of several process parameters such as plasma power, N2 flow concentration, quality of the bottom electrode, and oxygen content. The optimized deposition parameters are necessary for the growth of highly c-axis textured AlN thin film having a thickness of 300 nm on a Mo/SiO2/Si substrate. To this end, c-axis oriented AlN thin films were sputtered on a molybdenum (Mo) electrode at the low substrate temperature (300°C). The quality of the Mo electrode was optimized in terms of the surface roughness, interfacial energy, and full width at half maximum (FWHM) of x-ray diffraction (XRD) peak for facilitating the c-axis growth of the AIN film. Results indicate that the growth of AlN film in (002) orientation on the Mo electrode strongly depends on plasma power, the optimum value of which is found to be 300 W. Also, an extremely low FWHM of AlN (002) peak 0.62° is achieved at ∼ 38% N2 concentration. The oxygen content is also found to be an influential parameter, with a threshold value of 28% by atomic weight, beyond which amorphous growth of the AIN film is observed. The fabricated Mo-AlN-Mo structure has a dielectric constant of 8.89 and a capacitance value of 42 pF measured across the top electrode area of 400 × 400 μm2. The grown c-axis oriented AlN film can be used in applications such as the piezoelectric energy harvester (PEH) and the thin-film bulk acoustic resonator (FBAR).

Study on optimizing c-axis oriented AlN thin film for piezoelectric sensing applications controlling the sputtering process parameters

Preparation Technique Of Aln Piezoelectric Thin Film

Study on c-axis orientation of AlN thin film on the influence Al buffer layer and Ar/N2 gas flow ratio in reactive magnetron sputtering

Preparation of Aln Thin Films for Film Bulk Acoustic Resonator Application by Radio Frequency Sputtering

Influence of Process Parameters and Formation of Highly c-Axis Oriented AlN Thin Films on Mo by Reactive Sputtering

Deposition of c-axis orientation aluminum nitride films on flexible polymer substrates by reactive direct-current magnetron sputtering

An Investigation of the Structural and Surface Topography of Aluminum Nitride Thin Films Deposited at Low Sputtering Power for Piezoelectric Applications

Deposition of c-axis orientation aluminum nitride films on flexible polymer substrates by reactive DC magnetron sputtering

Preparation of AIN Thin Film by DC Sputtering on SiO2/Si and Analysis of Microstructure

Systematic approach for high piezoelectric AlN deposition

Reactive Sputtering of Aluminum Nitride (002) Thin Films for Piezoelectric Applications: A Review

Influence Of Metal Electrodes On C-Axis Orientation Of Aln Thin Films Deposited By Dc Magnetron Sputtering

Enhancement of c-Axis Oriented Aluminum Nitride Films via Low Temperature DC Sputtering

Growth of C-Axis Oriented Aln Thin Films on Titanium Alloy Substrate by Middle Frequency Magnetron Sputtering

Study of preparation of AlN Thin Films for FBAR Application by RF Sputtering

The Preparation of Scaln(002) Alloy Thin Films Deposited on Si(100) Substrates by Dc Reactive Magnetron Sputtering

Influence of Substrate Temperature on Structural Properties and Deposition Rate of AlN Thin Film Deposited by Reactive Magnetron Sputtering

Morphological Properties of AlN Piezoelectric Thin Films Deposited by DC Reactive Magnetron Sputtering

Flexible Surface Acoustic Wave Device with Aln Film on Polymer Substrate

Review on Deposition of C-Axis Oriented AlN Films by Reactive Magnetron Sputtering

Influence of sputtering parameters on structures and residual stress of AlN films deposited by DC reactive magnetron sputtering at room temperature