Effects of NH3 Plasma Pretreatment on Initial Reactions of Atomic Layer Deposition TaN Barrier Layer on SiOC Dielectric

Liang Sun,Yuan Xue,Shi-Jin Ding,Hao-Wen Guo,David Wei Zhang,Li-Kang Wang
DOI: https://doi.org/10.1063/1.2824385
IF: 4
2007-01-01
Applied Physics Letters
Abstract:Initial reaction mechanisms of atomic layer deposition TaN barrier layer on the different group-terminated SiOC surfaces have been investigated by density functional theory. TaCl5 molecules are hardly absorbed on –CH3 terminated surfaces mostly existing in SiOC dielectrics, which retards a uniform TaN layer growth. After NH3 plasma pretreatment, –NH2 terminated surfaces enhance the chemisorptions of TaCl5 and guarantee ALD TaN reaction sequences to go ahead, thus a uniform TaN barrier layer on SiOC dielectrics can be easily synthesized. In addition, HCl molecules as by-products are easily desorbed to benefit a high quality TaN layer with low Cl contaminations.
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