New Approach for the Preparation of Nanoporous Polyorganosilicate Low-K Films

Kai Xi,Rui Guo,Yangyang Weng,Hui He,Qiang Shao,Jie Cai,Qingmin Chen,Xuehai Yu,Xudong Jia
DOI: https://doi.org/10.1002/app.24646
IF: 3
2006-01-01
Journal of Applied Polymer Science
Abstract:The distribution of pores and the mechani- cal properties of materials are the key factors in preparing satisfactory low-k films. In the present study, a kind of sil- sesquioxane-polyethylene glycol (SSQ-PEG) was synthe- sized and used as a template to make the distribution of pores more even in the low-k films. The crosslinking den- sity of films could be adjusted by the sol-gel of tetrame- thoxysilane/dimethoxydimethylsilane with various pro- portions. The porosity of films could also be adjusted with different proportions of pendant PEG chains introduced. A dielectric constant as low as 2.1 had been achieved for nano- porous polyorganosilicate films with good tenacity. 2006
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