Memory Effect of Metal-Insulator-Silicon Capacitor with HfO2-Al2O3 Multilayer and Hafnium Nitride Gate

Shi-Jin Ding,Min Zhang,Wei Chen,David Wei Zhang,Li-Kang Wang
DOI: https://doi.org/10.1007/s11664-006-0003-6
IF: 2.1
2007-01-01
Journal of Electronic Materials
Abstract:Metal-insulator-silicon capacitors have been fabricated using novel insulators of SiO2/HfO2-Al2O3-HfO2 (HAH)/Al2O3 and metallic HfN gate, exhibiting a program-erasable characteristic. The memory capacitor presents a large memory window of 2.4 V under +12 V program/–14 V erase for 10 ms, no erase saturation, and sufficient electron- and hole-trapping efficiencies such as an electron density of ∼7 × 1012 cm–2 under 13 V program for 0.5 ms and a hole density of ∼4 × 1012 cm–2 under –12 V erase for 0.5 ms. The observed properties are attributed to the introduction of high permittivity atomic-layer-deposited HAH/Al2O3 as well as high work function HfN gate. The related mechanism is addressed accordingly.
What problem does this paper attempt to address?