Key Technology of Micromachined Temperature Sensor Arrays on Polyimide Flexible Substrates

Xiao Suyan,Che Lufeng,Li Xinxin,Wang Yuelin
DOI: https://doi.org/10.3321/j.issn:1004-132X.2005.z1.063
2005-01-01
Abstract:An 8 × 8 platinum film resistor temperature sensors array on polyimide flexible substrates were successfully fabricated based on MEMS flexible technology. The devices were especially applied to real-time supervision of the temperature on the complex geometries with highly curved surfaces. Two methods were being applied for the devices fabrication. The first was to bond a polyimide sheet to a stiff silicon carrier wafer temporarily with an adhesive and the second was to spin the polyamide acid and fully cure it to polyimide substrate film onto a Si wafer coated with a releaser layer, then the platinum thin film resistor temperature sensors were fabricated on two kinds of polyimide substrates. After completion of the fabrication process, the devices based on polyimide substrates were finally removed from the Si carrier wafers. Low temperature fabrication techniques were employed to minimize thermal cycling of the polyimide substrate. The test results show that the micro temperature sensing element on PI film exhibits good linearity and a temperature coefficient of resistance is close to 0.0023/°C.
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