A cost-effective flexible MEMS technique for temperature sensing

Suyan Xiao,Lufeng Che,Xinxin Li,Yuelin Wang
DOI: https://doi.org/10.1016/j.mejo.2007.01.022
IF: 1.992
2007-01-01
Microelectronics Journal
Abstract:A simplified, cost-effective flexible micro-electronic-mechanical systems (MEMS) technology has been developed for realizing a temperature-sensing array on a flexible polyimide substrate. The fabrication technique utilized liquid polyimide to form flexible film on the rigid silicon wafer using a temporary carrier during the fabrication. The platinum thin film is employed as temperature sensitive material and 8x8 temperature-sensing arrays were micromachined on the polyimide, from which the silicon wafer carrier was removed at the end of fabrication. The platinum thin film temperature sensor exhibits excellent linearity and its temperature coefficient of resistance reaches 0.00291^oC^-^1. Because of the effective thermal isolation, the flexible temperature sensors show a high sensitivity of 1.12@W/^oC at 10mA to the constant drive current. The flexible MEMS technology based on liquid polyimide enables the development of flexible, compliant, robust, and multi-modal sensor skins for many other important applications, such as robotics, biomedicine, and wearable microsystems.
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