Flexible Thermal Sensor Array for Wall Shear Stress Measurements

Zhao Jianguo,Ma Binghe,Deng Jinjun
DOI: https://doi.org/10.3969/j.issn.1671-4776.2009.07.006
2009-01-01
Abstract:Principles and requirements of the wall shear stress measurement were described.A fully flexible thermal sensor array with employed nickel as thermal material and polyimide as substrate was fabricated based on the MEMS technology for the distribution measurement of thermal transfer and flow parameters near wall.The sensor array with small size,highly integrated and flexible can be used for the curved wall shear stress measurement of the magnitude and distribution.Appropriate argon pressure and substrate temperature in sputtering nickel film,vacuum annealing and so on were carried out for improving the temperature coefficient of resistance.At the same time,the adhesion problem between nickel film and polyimide was also specially considered and solved.The experimental results show that the temperature coefficient of resistance of the flexible thermal sensor array can be as high as 4.64×10-3/℃ at 5-80 ℃,and it is with good linearity.
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