Abstract:In order to achieve desired mechanical properties of alloys by manipulating grain boundaries (GBs) via solute decoration, it is of great significance to understand the underlying mechanisms of microstructural evolution and plastic deformation. In this work, nanocrystalline (NC) Cu-W alloyed films with W concentrations spanning from 0 to 40 at% were prepared by using magnetron sputtering. Thermal stability (within the temperature range of 200 °C-600 °C) and hardness of the films were investigated by using the x-ray diffraction, transmission electron microscope (TEM) and nanoindentation, respectively. The NC pure Cu film exhibited substantial grain growth upon all annealing temperatures. The Cu-W alloyed films, however, displayed distinct microstructural evolution that depended not only on the W concentration but also on the annealing temperature. At a low temperature of 200 °C, all the Cu-W alloyed films were highly stable, with unconspicuous change in grain sizes. At high temperatures of 400 °C and 600 °C, the microstructural evolution was greatly controlled by the W concentrations. The Cu-W films with low W concentration manifested abnormal grain growth (AGG), while the ones with high W concentrations showed phase separation. TEM observations unveiled that the AGG in the Cu-W alloyed thin films was rationalized by GB migration. Nanoindentation results showed that, although the hardness of both the as-deposited and annealed Cu-W alloyed thin films monotonically increased with W concentrations, a transition from annealing hardening to annealing softening was interestingly observed at the critical W addition of ∼25 at%. It was further revealed that an enhanced GB segregation associated with detwinning was responsible for the annealing hardening, while a reduced solid solution hardening for the annealing softening.

Morphological Characterization and Nanoindentation Hardness Scatter Evaluation for Cu-W Thin Films Based on Wavelet Transform

Morphological characterization of Cu-W thin films based on wavelet transform

ANISOTROPY BEHAVIOR OF SURFACE MORPHOLOGY AND PHASE STRUCTURE OF Cu-W THIN FILMS

Surface Anisotropy Characterization and Microstructure of Cu–W Thin Films at Different Annealing Temperatures

Molecular dynamics simulation on nanoindentation response of a copper workpiece

Effect of Surface Roughness on Nanoindentation Test of Thin Films

Characterization of Surface Morphology of Copper Tungsten Thin Film by Surface Fractal Geometry and Resistivity

Heterogeneous Morphologies and Hardness of Co-Sputtered Thin Films of Concentrated Cu-Mo-W Alloys

Surface Morphology Anisotropy and Stress Distribution Uniformity in Annealed Cu–W Films

Nanoindentation studies of Cu–W alloy films prepared by magnetron sputtering

The W alloying effect on thermal stability and hardening of nanostructured Cu-W alloyed thin films

The Surface Mapping and Crystal Orientation of Body-Centered Cubic Thin Metal Tungsten Films of Different Thickness

Cu-W Thin Film Characterized by Surface Fractal and Resistivity

Research on Deforming Mechanism of Nanocrystalline Cu Thin Film under Contact Deformation

Nano-Indentation Properties of Tungsten Carbide-Cobalt Composites as a Function of Tungsten Carbide Crystal Orientation

Measuring elastoplastic properties of thin films on an elastic substrate using sharp indentation

Research of Delamination Phenomenon Under Nanoindentation on Cu/Ta/SiO2/Si Thin Film

Water Film Facilitating Plastic Deformation of Cu Thin Film under Different Nanoindentation Modes: A Molecular Dynamics Study

Molecular Dynamics Simulation of Nanoindentation of Cu/Au Thin Films at Different Temperatures

Size dependent mechanical properties of nanocrystalline Cu films

Surface Characterization of Cu/Ti Thin Films by Fractal Analysis