Investigation of Partial Silver-Plating in Electronic Packaging

HL Ning,FX Huang,JS Ma,ZT Geng,H Huang,C Lu
DOI: https://doi.org/10.3321/j.issn:1002-185x.2004.02.015
2004-01-01
Rare Metal Materials and Engineering
Abstract:A photolithograph technology is used to fabricate patterned fine lead frame, and the factor of partial silver-plating is discussed. We find the pretreatment and electroplating technology is the key of plating layer quality: 1, current density can influence the roughness of silver plating surface, if it is 0.5 A/dm(2), we can get the smooth silver plating; 2, electroplating time also plays an important role in controlling plating thickness, we can gain the even silver plating after 12 minsimilar to16 min plating.
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