Microstructure Metallization Using Electroless Gold Plating

YANG Bo,LI Zhi-hong
DOI: https://doi.org/10.3969/j.issn.1672-6030.2007.04.028
2007-01-01
Nanotechnology and Precision Engineering
Abstract:Electroless plating has been widely used in metallization of microstucture,but it makes most of the sample encapsulated with metal and the selective metallization difficult to be realized.By electroless plating with two steps,and controlling the experimental condition(such as activating time and water bath temperature),the gold layer was selectively electrolessly plated on special part of the structure.The electroless gold plating was based on a commercial noncyanide bath and took electroless nickel plating as the middle layer.The electroless gold plating is of low pinhole density,flat surface and high selectivity,which lays a foundation for high performance devices.
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