Experimental and theoretical studies of DMH as a complexing agent for a cyanide-free gold electroplating electrolyte

Xuefeng Ren,Ying Song,Anmin Liu,Jie Zhang,Peixia Yang,Jinqiu Zhang,Maozhong An

DOI: https://doi.org/10.1039/c5ra13140e

IF: 4.036

2015-01-01

RSC Advances

Abstract:Golden bright gold electrodeposit with a smooth and compact surface can be obtained from the introduced cyanide-free gold electroplating electrolyte.

chemistry, multidisciplinary

What problem does this paper attempt to address?

Computational Chemistry and Electrochemical Studies of Adsorption Behavior of Organic Additives during Gold Deposition in Cyanide-free Electrolytes

Xuefeng Ren,Ying Song,Anmin Liu,Jie Zhang,Guohui Yuan,Peixia Yang,Jinqiu Zhang,Maozhong An,Daniel Matera,Gang Wu

DOI: https://doi.org/10.1016/j.electacta.2015.06.147

IF: 6.6

2015-09-01

Electrochimica Acta

Abstract:In this work, a combined approach using density functional theory (DFT), molecular dynamic simulations, and electrochemical experiments was developed to study organic additives used for a cyanide-free gold electrodeposition process. When 5,5-dimethylhydantoin (DMH) is used as the complexing agent, organic additives with either imino groups or nitrogenous heterocyclic rings including polyethyleneimine (PEI), 2,2′-bipyridine, and nicotinic acid (NA) were systematically investigated. Electronic properties and orbital information of these studied additives were determined by quantum chemical calculations based on DFT. Compared to the other additives, PEI was predicted as the most promising one for the introduced DMH based gold electrodeposition. The theoretical prediction was further verified by using experimental results. In particular, the cathodic polarization of the gold electrodeposition was significantly improved in the presence of PEI. Also, the resulting gold electrodeposit shows obviously finer crystalline particles largely. In addition, molecular dynamic simulations determined that PEI molecules possess optimized adsorption behavior on the gold surface, suggesting its effectiveness to be additive in the studied cyanide-free Au-electrodeposition electrolytes.

electrochemistry
Proposing a new complexing agent for cyanide-free silver electroplating through a comprehensive computational study of dimethyl hydantoin

Zahra Hajiahmadi,Zahra Tavangar

DOI: https://doi.org/10.1080/08927022.2021.1895436

2021-03-28

Molecular Simulation

Abstract:A computational study is employed to provide an insight view of the behaviour and function of the complexing agents for environmental friendly silver electroplating. The electronic properties of the complexing agents in the gas and aqueous phase, as well as their silver complexes, interactions of them with the silver surface, and lateral interactions with each other, were explored using density functional theory (DFT). Also, molecular dynamics (MD) simulation were carried out to consider the solvent effects and more complexing agent molecules in the cyanide-free silver electroplating process. A complete investigation with details has been performed on 5,5-dimethyl hydantoin (DMH), which was introduced as a proper complexing agent. Then based on the quantum chemical calculations and MD simulation parameters, it was concluded that the proposed 5,5-dimethyl-2,4-dithio-hydantoin (DMDTH) with better performance could be promising as a proper complexing agent for silver electroplating. In this study, different computational methods have been used for a more accurate prediction of efficient complexing agents.

chemistry, physical,physics, atomic, molecular & chemical
Computational Chemistry and Electrochemical Mechanism Studies of Auxiliary Complexing Agents Used for Zn-Ni Electroplating in the 5-5'-Diethylhydantoin Electrolyte

Zhongbao Feng,Anmin Liu,Lili Ren,Jinqiu Zhang,Peixia Yang,Maozhong An

DOI: https://doi.org/10.1149/2.0591614jes

IF: 3.9

2016-01-01

Journal of The Electrochemical Society

Abstract:An effective approach is developed to investigate potential complexing agents in Zn-Ni bath by using density functional theory (DFT), molecular dynamic (MD) simulations and electrochemical experiments. Pyrophosphate is predicted as the most promising auxiliary complexing agent in introduced DMH based bath compared with other complexing agents owing to its weaker adsorption capacity. The DFT calculations show that the most possible and stable structures for zinc (II) and nickel (II) in the electrolyte are the complexes that with one pyrophosphate and two 5-5'-diethylhydantoins (DMH) as the complexing agents. The electrodeposition mechanism of Zn-Ni alloys in selected DMH-pyrophosphate electrolyte was studied by electrochemical measurements. The effects of Zn content, Ni content and bath temperature in the bath on CV curves were also investigated. The rate controlling rate is determined based on Koutecky-Levich equation and a mixed controlled process is observed. The nucleation mechanism of Zn-Ni alloys is a 3D instantaneous nucleation and the bath temperature has no effect on the nucleation of Zn-Ni alloys. The combined theoretical and experimental tests indicate that pyrophosphate is an excellent auxiliary complexing agent in DMH-based Zn-Ni bath and can also provide an efficient method to study or design complexing agents for other metal electroplating.

electrochemistry,materials science, coatings & films
The study of direct gold electrowinning from dilute cyanide solutions

Zhang Jianwu,Zhang Guizhen,Wu Xianhua,Sheng Guiyun

DOI: https://doi.org/10.3969/j.issn.1001-1277.2006.10.010

2006-01-01

Abstract:Based on analysis of direct gold electrowinning process in view of electrode process kinetics,Key factors of getting high recoveries of gold electrowinning are raising valid collision chance of Au(CN)~-_2 ions to surface of cathode electrode and lowering vice reaction about H_2.The recoverits of gold electrowinning from dilute cyanide solutions is about 98% by means of using porous electrode, lowering vice reaction of H_2 and two stage electrolysis.
Study on Composition of Karat Gold Deposition Without Cyanide by Electroforming

WU Dehai

1998-01-01

Abstract:In order to control the composition of Au Cu binary alloys deposition without cyanide. The parameters that affect the composition have been investigated by periodic reverse pulse electroforming. Anode is pure gold plate, cathode is pure copper plate. Parameters are changed in each experiment. The composition is tested by T 450 scanning electron microscope (SEM). The results show that it is related to the proportion between the ion concentration of gold and copper in the solution ( ρ (Au)/ ρ (Cu)), current density, the concentration of the complexing agent (DTPA) and temperature. The proportion between the ion concentration of gold and copper in the solution is the prime factor. This paper is significant to control composition of the deposition in manufacturing hollow core jewelry made of karat gold.
Electrochemical behavior of gold dissolution with a novel eco-friendly synthetic gold lixiviant

Qian Li,Siyu Dong,Yan Zhang,Rui Xu,Yongbin Yang,Tao Jiang

DOI: https://doi.org/10.1016/j.mineng.2022.107961

IF: 5.479

2022-12-10

Minerals Engineering

Abstract:Using environmentally friendly cyanide-free lixiviants to extract gold is of great significance with the rising requirement for environmental protection worldwide. A novel eco-friendly synthetic gold lixiviant (NESGL) that shows great potential to replace cyanide has been reported recently. In this paper, the electrochemical behavior of gold dissolution in the NESGL solution is investigated for the first time. Results suggest that gold occurs active dissolution in the potential of −300 to 600 mV where the coulombic efficiency of gold dissolution is >85.8 % but undergoes substantial reduction in oxidative dissolution at potentials higher than 600 mV due to the much-enhanced oxidation of NESGL. In contrast with cyanidation, no passivation on gold surface occurs in the NESGL solution achieving continuous leaching of gold with time. The change in pH significantly influences the NESGL dissolution of gold, and the optimal pH value appears to be 11. At the potential of 150–300 mV, the NESGL leaching of gold has an activation energy of 6.9–7.7 kJ·mol −1 , indicating a diffusion-controlled leaching process.

engineering, chemical,mining & mineral processing,mineralogy
Engineering Hydroxyls on a Metal-Organic Framework As Adsorbers and High-Activity Dehydrochlorination Sites for Selective Gold Recovery

Tianshu Zhang,Zhiang Hou,Xiaoqiang An,Meng Sun,Huachun Lan,Huijuan Liu,Jiuhui Qu

DOI: https://doi.org/10.1016/j.resconrec.2023.107286

IF: 13.716

2023-01-01

Resources Conservation and Recycling

Abstract:Design of stable materials for selective gold extraction from complex sources is of a great challenge due to the poor understanding of the fundamental conversion processes responsible for anionic gold. Herein, engineering terminal hydroxyls is reported to tune the interfacial adsorption of aqueous [AuCl4]−. The energetically favorable nucleation pathway endorses the conversion of [AuCl4]− to Au atoms on the adsorption sites by dehydrochlorination, forming polyhedral Au particles anchored on the Zr6OH-BTC. Compared to the atomically separated adsorption, this terminal hydroxyl‑assisted approach achieved 5.7 times enhancement in the gold recovery capacity. This study paves a new way to comprehend the conversation and adsorption mechanism for alleviating the emerging dilemma of gold recovery.
Study on Synergistic Strengthening of Gold Extraction with Copper Ethylenediamine Thiosulfate Using Pyrite and Nickel Ions

Xuecong Qin,Tao Zhang,Futing Zi,Hongbo Zhang,Guoping Li

DOI: https://doi.org/10.3390/min14010002

IF: 2.5

2023-12-20

Minerals

Abstract:Gold leaching using the copper–ethylenediamine–thiosulfate (Cu2+-en-S2O32−) system, which contains copper–ethylenediamine complexes, instead of the use of copper–ammonia catalysis, is environmentally friendly and cost-effective. In this study, pyrite and Ni2+ were added to the Cu2+-en-S2O32− system to clarify their individual and combined influence on gold leaching. The result obtained showed that when pyrite and Ni2+ were separately added to the system, the dissolution of gold was significantly inhibited. However, the disappearance of the negative impacts of these two substances when they were simultaneously added to the system revealed that they exhibited a synergistic effect on gold dissolution. Notably, Ni2+ weakened the promotional effect of pyrite on the formation of a Cu-containing passivation layer on the gold surface. Furthermore, the separate addition of Ni2+ and pyrite increased the corrosion potential of gold; thus, gold dissolution was inhibited. However, when added together, they brought about a decrease in the corrosion potential of gold, while increasing its dissolution rate. These findings provide a reference for the efficient extraction of pyrite-associated gold, which can be applied to improve the green extraction process of gold.

geochemistry & geophysics,mineralogy,mining & mineral processing
Reagent Elution Combined with Positive Pressure Filtration: A Zero-Discharge Method for Cyanide Tailings Remediation

Qiang Liu,Yating Luo,Jiyan Shi

DOI: https://doi.org/10.1016/j.jes.2021.06.028

IF: 6.9

2021-01-01

Journal of Environmental Sciences

Abstract:At present, the cyanide gold extraction process is still the main technology for gold production. Generated cyanide tailings containing highly toxic substances exhibit potential environmental risks. These tailings are in urgent need of purification treatment, especially after being classified as hazardous waste. In this study, the impacts of elution methods, operating time, tailings/water ratios, reagent types on the elution rates of cyanide were investigated. Furthermore, the composite elution method developed in this research was extended for engineering. Results showed that the optimum elution conditions were determined to be: stirring elution, tailings/water ratio (M/V; 1:1) and operating time (10-20 min). Besides, 4 reagents (sodium dodecyl benzene sulfonate, cyclodextrin, sodium silicate and calcium hydroxide) were selected from four categories of 21 reagents for further composite elution. The cyanide elution rate was the highest (90.7%±0.1%) while the molar ratio of these 4 reagents was 5:2:2:1. Moreover, the combination of reagent elution and positive pressure filtration improved the elution efficiency of cyanide (92.6%±0.8%). And the cyanide content in the toxic leaching solution was lower than the standard value (5.0 mg/L). Furthermore, the composite elution method developed in this study was also extended for engineering. The concentration of cyanide in the leachate was < 5.0 mg/L, and was stable during 189 days of detection. Notably, the effluent can be reused directly, or reused after further treatment. The zero discharge of effluents and solid wastes was realized in the processes. The above results provided supports for the engineering treatment of cyanide tailings.
Highly Efficient Recovery of Au(I) from Gold Leaching Solution Using Sodium Dimethyldithiocarbamate

Peng Yang,Xinrong Li,Shuliang Chen,Futing Zi,Xianzhi Hu

DOI: https://doi.org/10.1021/acsomega.4c01941

IF: 4.1

2024-05-14

ACS Omega

Abstract:As a sustainable, nontoxic and environmentally friendly cyanide-free gold leaching agent, thiosulfate has been applied to some extent in the field of hydrometallurgy. However, the difficult recovery of gold ions in gold leaching solutions limits further application of thiosulfate gold leaching technology. This study demonstrated the feasibility of gold recovery by sodium dimethyldithiocarbamate (SDD) precipitation and recycling of ammonia and a lixiviant in solution. SDD achieved the purpose of...

chemistry, multidisciplinary
Effects of four carboxyl-containing additives on imitation gold electroplating Cu-Zn-Sn alloys in an HEDP system

Chongyan Chen,Lifeng Ding,Qiang Li,Ruonan Wang,Jinxia Yuan,Qi Wang,Yanfeng Xue,Hongdao Li,Yulan Niu

DOI: https://doi.org/10.1007/s10008-021-04914-0

IF: 2.747

2021-02-15

Journal of Solid State Electrochemistry

Abstract:The requirements for using noncyanide imitation gold plating as decorative electroplating are increasing; thus, continuously improving the quality of the coating of the imitation gold plating and optimizing the coating process have become the current priority. In this experiment, hydroxyethylidene diphosphonic acid (HEDP) was used as the main complexing agent; CuSO4·5H2O, ZnSO4·7H2O, and NaSnO3·3H2O were the main salts; and NaOH and sodium carbonate were used as the buffers to prepare the electroplating solution. Using sodium citrate (SC), sodium potassium tartrate (SS), sodium gluconate (SG), and glycerol (Gl) as four additives, the effects of the number of carboxyl groups on the properties of a Cu-Zn-Sn alloy coating were compared. The electrochemical analysis showed that Cu-Zn-Sn alloy codeposition occurred at -0.50 Vvs.Hg|HgO. The scanning electron microscopy (SEM) results showed that the grain size of the coatings obtained with carboxyl-containing additives was more uniform than that obtained with the electroplating solution without additives. The X-ray fluorescence spectrometry (XRF) analysis revealed that the composition of the Cu-Zn-Sn alloy coating obtained by using SC as an additive in the electroplating solution was 89.75 wt% Cu, 9.61 wt% Zn, and 0.64 wt% Sn, and the color of the coating was golden yellow. The X-ray diffraction (XRD) pattern showed that the coating was a mixture of Cu, Cu5Zn8, CuSn, Cu6Sn5, and CuZn phases. The analysis of the electroplating solution by UV, IR, and NMR spectroscopy methods indicates that the additives improve the coating by affecting the complexation reaction of metal ions. These results can provide technical guidance for developing Cu-Zn-Sn ternary alloy electrodeposition technology with the new cyanide-free HEDP alkaline electroplating system.

electrochemistry
Efficient and stable leaching of gold in a novel ethydiaminedhephen acetic-thiosulfate system

Guowei Zhang,Lei Hou,Peng Chen,Qi Zhang,Yu Chen,Nasriddinov Zamoniddin Zainiddinovich,Chunhui Wu,López Valdivieso Alejandro,Feifei Jia

DOI: https://doi.org/10.1016/j.mineng.2024.108639

IF: 5.479

2024-03-03

Minerals Engineering

Abstract:Gold thiosulfate leaching is renowned for its non-toxic and high leaching efficiency. However, in traditional thiosulfate leaching systems, the presence of a high mixed potential and oxidizing metal ions in the solution environment leads to the consumption of thiosulfate through oxidation and causes passivation of the gold surface. Here, we proposed a novel thiosulfate leaching system mainly using non-toxic copper-ethydiaminedhephen acetic (EDDHA) replacing the conventional copper-ammonia. In this system, the gold leaching process mainly catalyzed by the stable Cu-EDDHA complex ion (as oxidizing agent analyzed by UV–vis spectrophotometer). The complexation of Cu(II) attributed to EDDHA reduces the mixed potential in the leaching process. The coordination also prevents the oxidation of thiosulfate by free copper ions. Accordingly, thiosulfate consumption during leaching is minimized, as it mitigates oxidation and self-decomposition. Besides, Raman and XPS spectrum demonstrate that introduce of EDDHA into the thiosulfate system can effectively eliminate the harmful surface passivation of gold, which enhance the gold leaching efficiency. In addition, by fulfilling a set of conditions, a gold extraction of 82.84 % can be attained in new system compared with 56.02 % for conventional cyanide leaching. Further, adding EDDHA to the thiosulfate leach reduced the reagent consumption from 103.19 kg/t to 10.54 kg/t. The results are benefits to the development and utilization of thiosulfate gold leaching.

engineering, chemical,mining & mineral processing,mineralogy
Optimizing Metallographic Etchants for Ancient Gold and Silver Materials

Shengyu Liu,Zisang Gong,Haizi Lu,Wei Zhang,Yanru Ma,Xiaolin Yang,Zhenda Xie,Gang Hu,Dongbo Hu

DOI: https://doi.org/10.3390/met12071229

IF: 2.695

2022-01-01

Metals

Abstract:In recent years, with the excavation of an increasing amount of gold and silver artifacts, there has been an urgent need to optimize the formulations and methods of metallographic etching. Herein, a kinetic control study is performed to investigate the mechanisms leading to poor results when etching ancient gold materials with aqua regia, i.e., when secondary AgCl impurities form during the etching of the sample surface. To this end, a concentrated ammonia and sodium thiosulfate solution is used to dissolve AgCl impurities and obtain high-quality metallographic images of ancient gold materials using a coordination reaction to generate stable free-state coordination ions from Ag+. On this basis, a ferric chloride + sodium thiosulfate method is proposed to optimize the formulation of the etchant for ancient silver materials. The formulation is efficient, safe and easy to handle, and solves the problems of the easy failure of the commonly used etchant of ammonia + hydrogen peroxide and the complicated preparation process of acidified potassium dichromate while maintaining the long-term stability of the etched Ag-Cu alloy samples.
The electrodeposition of low-Sn imitation gold Cu–Sn alloy from EDTA-tartrate double complexing agents

Lifeng Ding,Qiang Li,Jun Cheng,Jinxia Yuan,Qi Wang,Yanfeng Xue,Hongmei Dong,Yulan Niu

DOI: https://doi.org/10.1007/s10800-020-01500-6

IF: 2.925

2020-11-06

Journal of Applied Electrochemistry

Abstract:The electrodeposition of a Cu–Sn binary alloy on stainless steel from a cyanide-free alkaline electrolyte containing EDTA·2Na and C4H4O6KNa was investigated to explore the possibility of a cyanide-free double complexing system that maintains the decorative quality and coating performance. The Cu–Sn co-deposition occurred at −0.95 Vvs.Hg|HgO, and the height of cathode peak A from the BR bath was −0.0280 A. EDTA·2Na could simultaneously complex with Cu ions and Sn ions, while C4H4O6KNa could only complex with Cu ions, which was shown through the analysis of the cyclic voltammetry (CV) curves together with the nuclear magnetic resonance (NMR) results. The molar concentration ratio and sum of the two main salts or the two complexing agents, and the pH of the electroplating solutions were shown to influence the surface micromorphology, composition and phase structure of the Cu–Sn coatings. The scanning electron microscopy (SEM) analysis showed that the Cu–Sn coating obtained from the bath with EDTA-tartrate double complexing agents exhibited smaller grain sizes than that obtained from the bath with the single EDTA or tartrate complexing agent, and the smallest grain size of 0.2 μm was obtained from the BR bath. In addition to being smaller than the others, this coating contained uniform particle sizes. The energy-dispersive X-ray spectroscopy (EDS) analysis indicated that the composition of the Cu–Sn coating obtained from the BR bath was 92.8 wt% Cu and 7.2 wt% Sn, and this coating was golden in colour. X-ray diffraction (XRD) showed that the Cu–Sn coatings were crystalline and were composed of a mixture of Cu, Cu6Sn5, [Cu, Sn] and Cu10Sn3 phases, indicating the formation of Cu–Sn binary alloy. These results may provide theoretical guidance for the electrodeposition technology of other alloy coatings.

electrochemistry
An electrolyte for electrodeposition of hard gold based on choline chloride–urea ionic liquid

Yuqing Li,Mingliang Wang,Yulin Huang,Haiyan Yang,Tao Hang

DOI: https://doi.org/10.1016/j.elecom.2023.107454

IF: 5.443

2023-02-12

Electrochemistry Communications

Abstract:Hard gold has excellent physical and chemical properties, and is widely used in jewelry and the electronics industry. The deposition of hard gold has long been focused on cyanide-based aqueous electrolytes, which are highly toxic with relatively low electroplating efficiency due to the coreduction of hydrogen. Ionic liquids have recently been studied as a solvent for the electrodeposition of various metals. Herein, choline chloride–urea ionic liquid was used as the solvent with 5,5-dimethylhydantoin as the complexing agent and Co 2+ was added to produce cobalt-hardened gold deposits. The addition of Co 2+ promoted grain size refinement and improved the hardness of deposits. With 62.5 mg/L Co 2+ present in the electrolyte, the coating showed a high degree of hardness (2.3 GPa) and relatively good corrosion resistance.

electrochemistry
Microstructure Metallization Using Electroless Gold Plating

YANG Bo,LI Zhi-hong

DOI: https://doi.org/10.3969/j.issn.1672-6030.2007.04.028

2007-01-01

Nanotechnology and Precision Engineering

Abstract:Electroless plating has been widely used in metallization of microstucture,but it makes most of the sample encapsulated with metal and the selective metallization difficult to be realized.By electroless plating with two steps,and controlling the experimental condition(such as activating time and water bath temperature),the gold layer was selectively electrolessly plated on special part of the structure.The electroless gold plating was based on a commercial noncyanide bath and took electroless nickel plating as the middle layer.The electroless gold plating is of low pinhole density,flat surface and high selectivity,which lays a foundation for high performance devices.
Enhanced Raman Scattering Studies on Gold Surface Treated by Electrochemical Amalgamation

Gi Xue

1999-01-01

Abstract:A new etching method was developed to produce active gold surface with a suitable roughness, which can effectively enhance the Raman signal of molecules absorbed onto it. Using electrochemieal amalgamation under optimized conditions, high quality Raman spectra of the electrochemically deposited polymer submonolayer onto the activated gold surface were recorded. The molecular orientation of the polymer film was studied.
Novel and Green Chemical Compound of HAu(Cys) 2 : Toward a Simple and Sustainable Electrolyte Recipe for Cyanide-Free Gold Electrodeposition

Lei Jin,Jia-Qiang Yang,Fang-Zu Yang,Dongping Zhan,De-Yin Wu,Zhong-Qun Tian

DOI: https://doi.org/10.1021/acssuschemeng.0c04438

2020-09-11

Abstract:A novel approach to prepare a HAu(Cys)2 compound via a ligand exchange reaction in an aqueous solution is introduced. The prepared HAu(Cys)2 compound is shown as a very good main salt for environmentally friendly cyanide-free gold electrodeposition. From the established simple and sustainable electrolyte recipe just containing HAu(Cys)2, cysteine, and potassium hydroxide, the electrodeposited gold is pure, fine, and compact.The Supporting Information is available free of charge at <a class="ext-link" href="/doi/10.1021/acssuschemeng.0c04438?goto=supporting-info">https://pubs.acs.org/doi/10.1021/acssuschemeng.0c04438</a>.Confirmation of successful preparation for Au(Cys)2– coordination ion and HAu(Cys)2 compound, three control experiments, IR spectroscopy characterization, and DFT calculation details (<a class="ext-link" href="/doi/suppl/10.1021/acssuschemeng.0c04438/suppl_file/sc0c04438_si_001.pdf">PDF</a>)This article has not yet been cited by other publications.

chemistry, multidisciplinary,engineering, chemical,green & sustainable science & technology
Cyanide-free electrolyte for Au/Co–Au nano-multilayer electrodeposition utilising 5,5-dimethylhydantoin as a complexing agent

Gong Luo,Yuan Yuan,Deyu Li,Ning Li,Guohui Yuan

DOI: https://doi.org/10.1039/d2ra00104g

IF: 4.036

2022-01-01

RSC Advances

Abstract:Cross-section of Au/Co-rich nano-multilayer.

chemistry, multidisciplinary
Study on the preparation mechanism and property analysis of a localized Au coating by laser-induced cyanide-free electroplating

Kun Xu,Yangfan Tang,Zhihao Leng,Sishui Liu,Zhaoyang Zhang,Yuehua Ji,Wenhui Liang,Xiaojie Sun,Jinzhong Lu,Hao Zhu,Yang Liu

DOI: https://doi.org/10.1007/s10854-024-12756-5

2024-05-31

Journal of Materials Science Materials in Electronics

Abstract:Cyanide-free electroplating processes offer a safe and environmentally friendly alternative to cyanide electroplating; however, challenges such as low deposition rates and inadequate densification need to be addressed. This paper proposes using laser electrochemical compound energy fields to optimize the 5,5-Dimethylhydantoin (DMH) cyanide-free electroplating process to achieve efficient and high-quality localized Au plating. The cleaning and activation effects of laser irradiation on substrates under-liquid cleaning were studied, and the results demonstrate that laser irradiation effectively removes oxide films from the 316 L stainless steel substrate, reducing surface roughness and enabling cleaning, leveling, and activation effects. Experimental investigations were conducted to analyze the impact of laser-induced thermal effects on the electrodeposition quality. The results show that the thermal accumulation effect of the laser facilitates the enhancement of the deposition rate and quality without exceeding the etching threshold of the plating. Additionally, the influence of laser parameters such as single pulse energy, scan spacing, scan rate, and pulse frequency on the surface morphology of Au plating was studied, and high-quality plating was prepared by optimizing parameters. The test results show that the denseness, corrosion resistance, and bonding of Au plating prepared by laser-induced electrodeposition (LIED) are better than those prepared by electrodeposition (ECD).

materials science, multidisciplinary,engineering, electrical & electronic,physics, applied, condensed matter

Experimental and theoretical studies of DMH as a complexing agent for a cyanide-free gold electroplating electrolyte

Computational Chemistry and Electrochemical Studies of Adsorption Behavior of Organic Additives during Gold Deposition in Cyanide-free Electrolytes

Proposing a new complexing agent for cyanide-free silver electroplating through a comprehensive computational study of dimethyl hydantoin

Computational Chemistry and Electrochemical Mechanism Studies of Auxiliary Complexing Agents Used for Zn-Ni Electroplating in the 5-5'-Diethylhydantoin Electrolyte

The study of direct gold electrowinning from dilute cyanide solutions

Study on Composition of Karat Gold Deposition Without Cyanide by Electroforming

Electrochemical behavior of gold dissolution with a novel eco-friendly synthetic gold lixiviant

Engineering Hydroxyls on a Metal-Organic Framework As Adsorbers and High-Activity Dehydrochlorination Sites for Selective Gold Recovery

Study on Synergistic Strengthening of Gold Extraction with Copper Ethylenediamine Thiosulfate Using Pyrite and Nickel Ions

Reagent Elution Combined with Positive Pressure Filtration: A Zero-Discharge Method for Cyanide Tailings Remediation

Highly Efficient Recovery of Au(I) from Gold Leaching Solution Using Sodium Dimethyldithiocarbamate

Effects of four carboxyl-containing additives on imitation gold electroplating Cu-Zn-Sn alloys in an HEDP system

Efficient and stable leaching of gold in a novel ethydiaminedhephen acetic-thiosulfate system

Optimizing Metallographic Etchants for Ancient Gold and Silver Materials

The electrodeposition of low-Sn imitation gold Cu–Sn alloy from EDTA-tartrate double complexing agents

An electrolyte for electrodeposition of hard gold based on choline chloride–urea ionic liquid

Microstructure Metallization Using Electroless Gold Plating

Enhanced Raman Scattering Studies on Gold Surface Treated by Electrochemical Amalgamation

Novel and Green Chemical Compound of HAu(Cys) 2 : Toward a Simple and Sustainable Electrolyte Recipe for Cyanide-Free Gold Electrodeposition

Cyanide-free electrolyte for Au/Co–Au nano-multilayer electrodeposition utilising 5,5-dimethylhydantoin as a complexing agent

Study on the preparation mechanism and property analysis of a localized Au coating by laser-induced cyanide-free electroplating