Study the etching mechanism of photosensitive dry film on depositing gold during fabrication of printed circuit board

G.S. Tzeng,S.C. Jang,Y.Y. Wang,C.C. Wan
DOI: https://doi.org/10.1016/S0254-0584(97)80269-6
IF: 4.778
1997-01-01
Materials Chemistry and Physics
Abstract:A photosensitive dry film is etched while depositing gold on the panel of a nickel-plated printed circuit. This study examines the etched surface by conventional optical microscopy. However, an more accurate and convenient method, UV quantitative analysis method, is also developed. In addition, the mechanisms of etching photosensitive dry film are thoroughly examined. According to these results, OH−, H2,O2 and stirrer are four critical factors to be considered while etching photosensitive dry film during the deposition of gold. However, OH− concentration is the most influential factor. If a flow system is used during the deposition, the etched concentration of photosensitive dry film can be significantly reduced.
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