Abstract:The surface finish (SF) becomes a part of the solder joint during assembly and improves the component's reliability. Furthermore, the SF influences the solder joint's reliability by affecting the thickness of the intermetallic compound (IMC) layer at the solder interface and copper pads. In this experiment, five different alloys are used and compared with the SAC305 alloy, two of which, Innolot and SAC-Bi, are bi-based solder alloys. This study includes three common SFs: electroless nickel immersion gold (ENIG), immersion silver (ImAg), and organic solderability preserve (OSP). The performance of three surface finishes is examined in terms of component characteristic life. All of the boards were isothermally aged for twelve months at 125 °C. The boards were then exposed to 5000 cycles of thermal cycling at temperatures ranging from -40-+125 °C. Most of the current research considers only one or two factors affecting the reliability of the electronic package. This study combines the effect of multiple factors, including solder paste content, SF, isothermal aging, and thermal cycling, to ensure that the test conditions represent real-world applications. In addition, the electronics packages are assembled using commercialized alloys. The current study focuses on a high-performance alloy already present in the electronic market. The failure data were analyzed statistically using the Weibull distribution and design of experiments (DOE) analysis of variance (ANOVA) techniques. The findings reveal that the micro and uniformly distributed precipitates in solder microstructures are critical for high-reliability solder joints. Re-crystallization of the thermally cycled solder joints promotes the local formation of numerous new grains in stress-concentrated zones. As the fracture spreads along these grain boundaries and eventually fails, these new grains participate in crack propagation. Aging significantly worsens this situation. Finally, although the ENIG surface finish with its Ni layer outperforms other SFs, this does not imply that ENIG is more reliable in all solder paste/sphere/finish combinations.

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Failure Analysis on Electrolytic Ni/Au Surface Finish of Pcb Used for Wire Bonding and Soldering

Failure Analysis of Debonding of Gold on Electrolytic Nickel and Gold

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Packaging Reliability Effect of ENIG and ENEPIG Surface Finishes in Board Level Thermal Test under Long-Term Aging and Cycling

A Comprehensive Study of Surface Finishes for High Frequency/High Speed Applications

Failure analysis on the pin fin heat sink for the power module of new energy vehicles

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Failure Analysis of the Contamination on the Pins of the SOT Packages

Failure analysis of electroplating on sliver termination in multilayer ceramic capacitors (MLCCs)

Failure Analysis for Gold Wire Bonding of Sensor Packaging Based on Experimental and Numerical Methods

Lifetime Prediction of Electrochemical Ion Migration with Various Surface Finishes of Printed Circuit Boards

Surface finish effect on reliability of SAC 305 soldered chip resistors

Effects of High-Temperature Treatment on the Reaction Between Sn-3%Ag-0.5%Cu Solder and Sputtered Ni-V Film on Ferrite Substrate

Failure analysis and reliability evaluation of silver-sintered die attachment for high-temperature applications

Effect of Surface Finish of Substrate on Mechanical Reliability of in-48SN Solder Joints in Moems Package

The design of low-temperature solder alloys and the comparison of mechanical performance of solder joints on ENIG and ENEPIG interface

Au Plating Failure Prevention on the Electronic Industry

Investigation Of Tungsten Rich Residue Defects Induced By Electron Beam Inspection Post Contact Tungsten Chemical And Mechanical Polish

Interfacial Reaction Between Sn3.0Ag0.5Cu Solder and ENEPIG for Fine Pitch BGA by Stencil Printing

The Effect of Micro-Alloying and Surface Finishes on the Thermal Cycling Reliability of Doped SAC Solder Alloys