Abstract:In the field of advanced electronic packaging, the common method for structural interconnection is using Sn-based solder and Cu-based substrate soldering. However, the reaction between Sn-based solder and Cu-based substrate is rapid, leading to the formation of thick and brittle Cu-Sn IMCs at the interface, causing stress concentration in the solder joint. Meanwhile, the consumption of Cu substrate results in the generation of Kirkendall voids, leading to a sharp decrease in mechanical performance and eventual fracture. During production, a diffusion barrier layer is typically introduced between the solder and substrate to suppress the formation of Cu-Sn IMCs and enhance the reliability of the solder joint. Currently, the industry often employs Ni-P plating as the diffusion barrier layer. However, the Ni-P diffusion barrier layer is prone to long-term failure. In the soldering process, Ni-P generates columnar crystalline structure Ni3P, providing diffusion pathways for atoms. By introducing the new element W, the recrystallization of the barrier layer can be effectively suppressed, promoting the formation of an amorphous structure, eliminating grain boundaries as diffusion pathways, thereby exhibiting excellent diffusion barrier performance, especially improved thermal stability. Based on this background, this work developed a ternary Ni-W-P diffusion barrier layer prepared by electroplating (with a P content of 14-15wt% and W content of 7-8wt%), which exhibits uniform dense coating and good thermal stability. The study compared the interface reactions of Cu/Ni-W-P/Sn-58Bi and Cu/Ni-P/Sn-58Bi after soldering at 180°C for different durations. The results indicate that the IMC layer at the Cu/Ni-P/Sn-58Bi interface grows rapidly, whereas under the same heat treatment, the thickness of the IMC layer at the Ni-W-P/Sn-58Bi interface is significantly smaller than that of the Ni-P interface layer, with the IMC layer mainly composed of (Ni, Cu)3Sn4 phase. The solder joints formed in Ni-W-P/Sn-58Bi are very thin and stable during different soldering processes, demonstrating the blocking effect of the Ni-W-P layer. The findings reveal that Ni-W-P coatings hold great promise as diffusion barrier layers, capable of enhancing the reliability of long-term reflow soldering procedures.

Effect of Ni(P) Layer Thickness on Interface Reaction and Reliability of Ultrathin ENEPIG Surface Finish

Effect Of Ni(P) Thickness Of Ultrathin Enepig On The Interfacial Reaction And Board Level Reliability Of Solder Joints

Effect of expelling P content on Ni(P) dissolution and reaction with SnAgCu(Ni)

Solid-state growth kinetics of intermetallic compounds in Cu pillar solder flip chip with ENEPIG surface finish under isothermal aging

Effects of the Ni(P) plating thickness on microstructure evolution of interfacial IMCs in Sn–58Bi/Ni(P)/Cu solder joints

Interfacial reaction between Sn-Ag solder and electroless Ni-Fe-P diffusion barriers with different internal microstructure

Electroplated Ni-W-P Amorphous Layer and the Interaction Between Ni-W-P Barrier and Sn-Bi Solder

Effect of electromigration on interfacial reaction in Ni/Sn/Ni-P solder joint

Comparative Study on Interfacial Reactions Between Sn-3.5Ag, Sn-3.0Ag-0.5Cu Solder Balls and ENEPIG Pad after Multiple Reflows

Current-induced Interfacial Reactions in Ni/Sn–3Ag–0.5Cu/Au/Pd(P)/Ni–P Flip Chip Interconnect

Interfacial reactions between Sn-2.5Ag-2.0Ni solder and electroless Ni(P) deposited on SiCp/Al composites

Effect of P and Aging on Microstructure and Shear Strength of Sn–2.5Ag–2.0Ni/Ni(P) Solder Joints

The Interfacial Reaction between Amorphous Ni-W-P Coating and Sn-58Bi Solder

Interfacial Microstructure and Mechanical Reliability of Sn-58Bi/ENEPIG Solder Joints

Effect of Surface Finish (OSP and ENEPIG) on Failure Mechanism Induced by Electromigration in Sn-3.0Ag-0.5Cu Flip Chip Solder Interconnect

EFFECT OF ELECTROMIGRATION ON INTERFACIAL REACTION IN Ni/Sn3.0Ag0.5Cu/Cu FLIP CHIP SOLDER JOINTS

Interfacial Reaction Between Sn3.0Ag0.5Cu Solder and ENEPIG for Fine Pitch BGA by Stencil Printing

Effects of Electroless Nickle Immersion Gold Protective Finish of Cu on the Reliability of the Lead--free Solder Joint

The design of low-temperature solder alloys and the comparison of mechanical performance of solder joints on ENIG and ENEPIG interface

Study on the adhesion and reliability of Epoxy Molding Compound and shaped Pd Preplated leadframes

Packaging Reliability Effect of ENIG and ENEPIG Surface Finishes in Board Level Thermal Test under Long-Term Aging and Cycling