Analysis on Flow Properties of Chemical Mechanical Polishing Process

张朝辉,雒建斌,温诗铸
DOI: https://doi.org/10.3969/j.issn.0254-0150.2004.04.011
2004-01-01
Abstract:The force balance relations were set up on the basis of continuum fluids theory and the kinematic relations. The flow governing equation, i.e. the Reynolds equation for chemical mechanical polishing (CMP) process was deduced with Newtonian fluids. The typical pressure distribution was simulated and the relations between the dimensionless load, dimensionless moments vs angular velocity of the pad were given. The pressure varies with the position in the radial direction and the increase in pad roll velocity is conducive to the remove rate of CMP process.
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