Low-Temperature Epitaxy of Phosphorus Doped Si and Si1-Xgex Films by Rtp/Vlp-Cvd

XD Huang,P Han,YD Zheng,LQ Hu,RH Wang,SM Zhu
DOI: https://doi.org/10.1109/icsict.1995.500242
1995-01-01
Abstract:In situ phosphorus doped Si and Si1-xGex epitaxial layers have been grown at 600°C in a very low pressure chemical vapor deposition system using SiH4 and 1800 ppm PH 3 diluted in H2. The epitaxial growth rates were found to decrease with phosphorus doping and input of the diluent H2. The constant phosphorus concentration with depth for a steady flow of PH3 was achieved. Dopant concentration is a function of gas phase dopant concentration. Chemical concentrations as high as 2.5×1020 P/cm3 were obtained in Si epitaxial layers. The doping level can be modulated between 1.2×10 20 and 1.5×1017 P/cm3. There is no evidence of a time-dependent accumulation of phosphorus on the growth surface or the reactor wall
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