In Situ Phosphorus Doping of Si and Si<sub>1-x</sub>Ge<sub>x</sub> Epitaxial Layers by RTP/VLP-CVD

Xiao Dong Huang,Ping Han,Yi Shi,You Dou Zheng,Li Qun Hu,Rong Hua Wang,Shun Ming Zhu
DOI: https://doi.org/10.4028/www.scientific.net/MSF.196-201.349
1995-01-01
Materials Science Forum
Abstract:In situ phosphorus doping Si and Si1-xGex epitaxial layers have been grown at 600 degrees C in a very low pressure chemical vapor deposition system using SiH4 and PH3 diluted in H-2. The epitaxial growth rates were found to decrease with phosphorus doping. The constant phosphorus concentration with depth for a steady how of PH3 was achieved. Dopant concentration is a function of gas phase dopant concentration. Chemical concentration as high as 2.5 x 10(20) P/cm(3) was obtained in Si epitaxial layers. The doping level can be modulated between 1.2 x 10(20) and 1.5 x 10(17) P/cm(3). There is no evidence of a time-dependent accumulation of phosphorus on the growth surface of the reactor wall.
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