Effect of Rapid Thermal Annealing on Behavior of Nitrogen in GaAsN Alloys

X. Z. Chen,D. H. Zhang,Y. J. Jin,J. H. Li,J. H. Teng,N. Yakovlev
DOI: https://doi.org/10.1016/j.jcrysgro.2012.03.059
IF: 1.8
2012-01-01
Journal of Crystal Growth
Abstract:We report the behavior of nitrogen implanted into GaAs wafer upon annealing in the range of 500°C to 1000°C. The SIMS results show out-diffusion of nitrogen and the peaks in the distribution profiles of implanted nitrogen broadening. XPS measurements indicate that the N bonding configuration before annealing is contributed by NAs, interstitial NN and the NAs complex. However, NAs complex disappears completely upon annealing at temperature higher than 700°C. The spectra and quantitative analysis reveal that a saturation of NAs happens as annealing temperature increases. Before the saturation, the substitional NAs keeps rising, which leads to the elevation of n-type doping level in host. Whereas beyond the saturation, the excess thermal energy beyond saturation triggers the kick-out mechanism and induces dramatic increase in the amount of NN split interstitials, resulting in suppression of the nitrogen out-diffusion during annealing and pining of the Fermi level.
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