Application of Multi-Mask Layers for High Aspect Ratio Soft Mold Imprint

Zhihao Wang,Tangyou Sun,Lei Wang,Qiang Zuo,Yanli Zhao,Zhimou Xu,Wen Liu
DOI: https://doi.org/10.1088/0960-1317/22/12/125025
2012-01-01
Journal of Micromechanics and Microengineering
Abstract:Soft mold imprinting has been widely used to improve quality and uniformity in large area nano-imprint processes because of its flexibility. However, the aspect ratio of soft mold imprinting is limited because of its physical properties. In this paper, a multi-mask layers transfer process was demonstrated to realize a high aspect ratio in the soft mold imprint process. In this process, a thin hard mask was used as an intermediate mask for a high aspect ratio mask layer fabrication. Based on this, a 60 nm line width gratings mask, whose aspect ratio is higher than 4, was fabricated; we also realized a uniform photonic crystal (PC) pattern on large and rough gallium nitride (GaN) epitaxial wafers.
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