Evaluation of MOS Interface Trap Generation after BTI Stress Using Flicker Noise
Yi Jiang,Yanning Chen,Fang Liu,Bo Wu,Yongfeng Deng,Dawei Gao,Junkang Li,John Robertson,Rui Zhang
DOI: https://doi.org/10.1016/j.microrel.2024.115478
IF: 1.6
2024-01-01
Microelectronics Reliability
Abstract:In this study, the weak bias temperature instability (BTI) in both Si p- and n-MOSFETs was systematically investigated using subthreshold swing degradation (Delta S Delta S factor), threshold voltage shift (Delta Vth) Delta V t h ) and flicker noise (1/f f noise) characteristics. It is found that the 1/f f noise characteristics exhibit more pronounced deterioration compared to the Si/SiO2 2 interface degeneration under weak BTI stress. Furthermore, the observed linear relationship between the 1/f f noise characteristics and MOS interface trap density was confirmed by the carrier number fluctuation model, indicating that 1/f f noise characteristics could be considered as a sensitive and effective indicator for assessing MOS interface quality after weak BTI stress.