Abstract:Our recent investigations and understanding of the negative bias temperature instability (NBTI) degradation in p-MOSFETs with ultrathin SiON gate dielectric are reviewed. The progressive understanding of NBTI mechanism is mainly related to the novel measurement techniques we developed. We show in this paper the following: 1) For the conventional charge pumping and direct-current current-voltage interface trap measurement, the interface trap density Nit is underestimated due to the recovery during measurement delay. The existing Nit data should be reexamined; 2) an ultrafast pulsed I-V method [fast pulsed measurement (FPM)] is developed to measure DeltaVth with measurement time tM = 100 ns. It can be considered as free from recovery during measurement; 3) due to the degradation during the initial threshold voltage measurement, the existing slow on-the-fly (OTF) DeltaVth measurement distorts (overestimates) the slope and induces a kink at early stress time in the Log-Log curve of the time evolution of NBTI degradation. A fast OTF DeltaVth measurement method is developed to overcome this problem; 4) a novel OTF interface trap (OFIT) measurement method is developed which is free from interface trap recovery during measurement. The OFIT measurement provides the most reliable data to inspect the interface trap R-D model; 5) combining the OFIT and FPM measurements, we decompose the NBTI DeltaVth into two components: A slow DeltaVth it component contributed by with a slow recovery time longer than 50mus and a fast DeltaVth ox component contributed by DeltaVox with a broad spectrum of recovery time, including a component with very fast recovery time (100 ns); and 6) the dynamic degradation by DeltaVth it component is frequency-independent and can be measured by a dc method, whereas the dynamic degradation DeltaVth ox by component measured by FPM is increased by increasing frequency. The ten-year lifetime of the p-MOSFETs is mainly determined by the degradation of the DeltaVth it component.

Studies of NBTI in Pmosfets with Thermal and Plasma Nitrided SiON Gate Oxides by OFIT and FPM Methods

Investigations of Nbti by Conventional and New Measurement Methods for P-Mosfets

On-The-Fly Interface Trap Measurement And Its Impact On The Understanding Of Nbti Mechanism For P-Mosfets With Sion Gate Dielectric

New Insights of Bti Degradation in Mosfets with Sion Gate Dielectrics

Understand NBTI Mechanism by Developing Novel Measurement Techniques

Investigation on the role of hole traps under NBTI stress in PMOS device with plasma-nitrided dielectric oxide

Impact of Interface Traps Generation on Flicker Noise Degradation in SI Pmosfets

Issues And Controversies In Nbti Degradation And Recovery Mechanisms For P-Mosfets With Sion Gate Dielectrics

Evaluation of MOS Interface Trap Generation after BTI Stress Using Flicker Noise

PBTI and HCI Degradations of Ultrathin Body InGaAs-On-Insulator Nmosfets Fabricated by Wafer Bonding

Direct Experimental Evidence of Hole Trapping in Negative Bias Temperature Instability

The Energy Distribution of NBTI-induced Hole Traps in the Si Band Gap in PNO Pmosfets

Investigation of nitrogen enhanced NBTI effect using the universal prediction model

Dynamic NBTI characteristics of p-MOSFET with N-plasma SiON Gate Dielectric

Investigation of Negative Bias Temperature Instability Effect in Nano PDSOI PMOSFET

Fluorine IMP effect on negative bias temperature instability and process induced defects

Factors for Negative Bias Temperature Instability Improvement in Deep Sub-Micron CMOS Technology

On the Understanding of pMOS NBTI Degradation in Advance Nodes: Characterization, Modeling, and Exploration on the Physical Origin of Defects

Impact of Channel Thickness on the NBTI Behaviors in the Ge-OI Pmosfets with Al2O3/GeOx Gate Stacks

Systematic Study on Predicting the Lifetime of Si pMOSFETs During NBTI Stress Based on Low-Frequency Noise.

Drain Bias Effect on the Interface Traps of Pmosfets under Negative Bias Temperature Stress