Low-Temperature ZnO TFTs Fabricated by Reactive Sputtering of Metallic Zinc Target

Shaojuan Li,Yong Cai,Dedong Han,Yi Wang,Lei Sun,Mansun Chan,Shengdong Zhang
DOI: https://doi.org/10.1109/ted.2012.2205151
2012-01-01
Abstract:A low-temperature metallic-zinc-target reactive sputtering technology is used to fabricate a ZnO thin-film transistor (TFT). The effect of the $\hbox{O}_{2}/\hbox{Ar}$ flow rate ratio on the performance of the resulting TFTs is investigated in detail. It is found that an $\hbox{O}_{2}/\hbox{Ar}$ ratio of 0.75–0.8 produces devices with the best performance. The maximum processing temperature used in this brief is 150 $^{\circ}\hbox{C}$, and the fabricated TFTs have a saturation mobility of 7.4 $\hbox{cm}^{2}/(\hbox{V}\cdot \hbox{s})$, an on–off current ratio of more than $\hbox{1} \times \hbox{10}^{7}$ , and a subthreshold swing of 0.58 V/dec. Experimental results also show that using $\hbox{SiO}_{x}$ as gate dielectric instead of $\hbox{SiN}_{x}$ can improve both carrier mobility and subthreshold.
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