Abstract:Computer-Aided Design (CAD) tools are extensively used throughout all of the steps in a VLSI design flow. The physical design domain is one of the three domains that are conceptually abstracted in representing a VLSI design flow. This research work focuses on three areas in VLSI physical design domain: clock tree design and buffer insertion, interconnect model order reduction and LVS verification. First, an optimal buffer insertion for clock delay and skew minimization algorithm is developed based on the theory that the minimal clock delay can be obtained by equalizing derivatives of a convex function, and the minimal clock skew can be achieved by equalizing delay functions of different source-to-sink paths. Experimental results show that the presented algorithm achieves both minimal delay and skew in real clock tree design. Further, an automatic clock tree design algorithm is developed for realizing the pre-specified clock arrival time requirements that often occur in an IP block based design environment. In this proposed strategy, planar clock routing and buffer insertion are carried out simultaneously to minimize clock delay and skew, and a full waveform simulation is applied to ensure the signal integrity necessary for high-speed VLSI design. Second, an efficient balanced truncation realization algorithm is presented for interconnect model order reduction. This algorithm shows that there is no need to solve the whole Lyapunov equation for controllability and observability grammians before obtaining approximation to their predominant spaces, and a linear order reduction algorithm can be achieved by extending the O(n) Krylov Subspace Oblique Projection method. Finally, a unique LVS methodology is proposed for the verification of a quad-core microprocessor designed with a triple-well 90-nm CMOS technology. Due to the IP reuse, the standard LVS flow is incapable of handling the additional design complexity in verifying the LVS for the chip designed with multiple power domains. This proposed LVS strategy consists of two phases. The first phase involves verifying LVS at the block level as well as the full-chip level. The second phase aims at verifying the integrity of the multi-power-domain power grid. The proposed LVS methodology was successfully verified by real silicon.

Two-Dimensional Stack Generation and Block Merging Algorithms for Analog VLSI

Algorithms for Analog VLSI 2D Stack Generation and Block Merging

Two-dimensional common-centroid stack generation algorithms for analog VLSI

A Novel STACK Generation Technique for MOS Analog Cell Circuit Layout

Physical Design of the "2.5D" Stacked System

Optimal Stack Generation for CMOS Analog Modules with Parasitic and Mismatch Constraints

2-D Hierarchical Compaction Algorithm for VLSI Layout Reuse

A Novel Algorithm for Placement of Mixed Macro Block and Standard Cell Designs

Stacked Lateral Gate-All-Around Metal–Oxide–Semiconductor Field-Effect Transistors and Their Three-Dimensional Integrated Circuits

Engineering Top Gate Stack for Wafer-Scale Integrated Circuit Fabrication Based on Two-Dimensional Semiconductors

Bipartition for 2.5-D floorplanning based on corner block list representation

Hierarchical Timing-driven Layout Based on .25um Technology

Arithmetic Unit Design Using 180nm TSV-based 3D Stacking Technology

Different designs of TSVs for 3D IC: Signal integrity analysis with cascaded scattering matrix

Algorithms and Methodology in Physical Domain Optimization for High-Performance Vlsi Design

Improving FPGA Design with Monolithic 3D Integration Using High Dense Inter-Stack Via.

A Feasibility Study of 2.5d System Integration

2.5-Dimensional VLSI System Integration

An Effective Detailed Placement Algorithm for Large-Scale Mix-Mode IC Design

3D Chip Stack Technology Using Through-Chip Interconnects

Stacked 3-D Fin-CMOS Technology