Abstract:Hierarchical art was used to solve the mixed mode placement for three dimensional (3-D) integrated circuit design. The 3-D placement flow stream includes hierarchical clustering, hierarchical 3-D floorplanning, vertical via mapping, and recursive two dimensional (2-D) global/detailed placement phases. With state-of-the-art clustering and de-clustering phases, the design complexity was reduced to enhance the placement algorithm efficiency and capacity. The 3-D floorplanning phase solved the layer assignment problem and controlled the number of vertical vias. The vertical via mapping transformed the 3-D placement problem to a set of 2-D placement sub-problems, which not only simplifies the original 3-D placement problem, but also generates the vertical via assignment solution for the routing phase. The design optimizes both the wire length and the thermal load in the floorplan and placement phases to improve the performance and reliability of 3-D integrate circuits. Experiments on IBM benchmarks show that the total wire length is reduced from 15% to 35% relative to 2-D placement with two to four stacked layers, with the number of vertical vias minimized to satisfy a pre-defined upper bound constraint. The maximum temperature is reduced by 16% with two-stage optimization on four stacked layers.

2-D Hierarchical Compaction Algorithm for VLSI Layout Reuse

A Fast OPC Algorithm for IC Layout Based on 1-D Cells after Optimization of Gap Distribution

Critical Area Computation Based On Equidistance Line For Small Layouts

Symbolic Layout Compaction under Conditional Design Rules.

Efficient Hierarchical Algorithm for Mixed Mode Placement in Three Dimensional Integrated Circuit Chip Designs

ECOP:A Row-Partition Based Incremental Placement Algorithm for Standard Cell Layout Design

Bipartition for 2.5-D floorplanning based on corner block list representation

An Automatic 2.5-D Layout Design Flow

Hierarchical Timing-driven Layout Based on .25um Technology

Array Based HV/VH Tree: an Effective Data Structure for Layout Representation.

A layout transformation method for the high-precision parasitic extraction and timing analysis of VLSI interconnects

Via assignment algorithm for hierarchical 3-D placement

A Packing Algorithm for Hierarchical FPGA

Two-dimensional common-centroid stack generation algorithms for analog VLSI

3-D placement algorithm with vertical via count constraints

Deterministic VLSI block placement algorithm using Less Flexibility First principle

Effective Analytical Placement for Advanced Face-to-Face-Bonded Circuit Designs.

Congestion Driven Placement for Three Dimensional Integration Chip Design Using Uniformity Modeling Approach

Floorplanning For 2.5-D System Integration Using Multi-Layer-Bsg Structure

Cubic Packing with Various Candidates for 3D IC Design

3D IC optimal layout design. A parallel and distributed topological approach