Abstract:Standard cells are essential components of modern digital circuit designs. With process technologies advancing toward 2nm, more routability issues have arisen due to the decreasing number of routing tracks, increasing number and complexity of design rules, and strict patterning rules. The state-of-the-art standard cell design automation framework is able to automatically design standard cell layouts in advanced nodes, but it is still struggling to generate highly competitive Performance-Power-Area (PPA) and routable cell layouts for complex sequential cell designs. Consequently, a novel and efficient methodology incorporating the expertise of experienced human designers to incrementally optimize the PPA of cell layouts is highly necessary and essential. High-quality device clustering, with consideration of netlist topology, diffusion sharing/break and routability in the layouts, can reduce complexity and assist in finding highly competitive PPA, and routable layouts faster. In this paper, we leverage the natural language and reasoning ability of Large Language Model (LLM) to generate high-quality cluster constraints incrementally to optimize the cell layout PPA and debug the routability with ReAct prompting. On a benchmark of sequential standard cells in 2nm, we demonstrate that the proposed method not only achieves up to 19.4% smaller cell area, but also generates 23.5% more LVS/DRC clean cell layouts than previous work. In summary, the proposed method not only successfully reduces cell area by 4.65% on average, but also is able to fix routability in the cell layout designs.

Symbolic Layout Compaction under Conditional Design Rules.

2-D Hierarchical Compaction Algorithm for VLSI Layout Reuse

Critical Area Computation Based On Equidistance Line For Small Layouts

Layout Optimization of Truss Structures with Modular Constraints

Fast Timing Closure Layout Design Based on Region Constraints

Study of strip layout in progressive die CAD for IC lead frame based on optimizing rules

CoLay: Controllable Layout Generation through Multi-conditional Latent Diffusion

Module placement with boundary constraints using O-tree representation

Constrained Layout Generation with Factor Graphs

Floorplanning with Constraint Extraction Based on Interconnecting Information Analysis

Timing-Aware Fill Insertions with Design-Rule and Density Constraints

3D IC optimal layout design. A parallel and distributed topological approach

PLay: Parametrically Conditioned Layout Generation using Latent Diffusion

Cubic Packing with Various Candidates for 3D IC Design

Constraints Generation for Analog Circuits Layout

Lithography-simulation-based Design for Manufacturability Rule Development: an Integrated Circuit Design House’s Approach

Large Language Model (LLM) for Standard Cell Layout Design Optimization

Chip Layer Assignment Method for Analytical Placement of 3D ICs

O.O: Optimized One-die Placement for Face-to-face Bonded 3D ICs

Standard Cell Library Evaluation with Multiple lithography-compliant verification and Improved Synopsys Pin Access Checking Utility

Optimizing Routability in Large-Scale Mixed-Size Placement