Abstract:The size of the implemented circuit plays a vital role in maximizing the performance of the chip. Hence, researchers are looking to utilize the extra dimension to improve performance, which requires the development of new methods and techniques for efficient implementation. This paper proposes a new, simple, efficient representation in 3D VLSI Floorplan named 3D O-Tree representation for Electronic Design Automation (EDA). Since the 3D floorplan packing problem is NP-hard (Nondeterministic Polynomial time), the novel representation is accompanied with an adaptive modified Memetic Algorithm with a kill strategy for fast performance. The tool presented in this paper employs Genetic Algorithm for global exploration, and an improved compatible local technique is used to exploit promising search regions for an improved solution. This representation has been found to be effective in obtaining an efficient packed 3D floorplan. In the case of okp benchmarks, the proposed algorithm has achieved the best stated minimum volume yet for okp1 and okp3 benchmarks with 4.62% and 1.87% improvement respectively. The rest of the okp benchmarks have achieved near-to-best previous results. When checked on four standard Beasley benchmarks, better floorplans have been achieved with the proposed representation. They are found to be more effective and efficient than the current state-of-the-art research, with a range of 1.6% to 9.29% improvement as compared to the volume of the previous best-reported results. Beasley 7 retains the previous best solution in terms of volume, improving significantly in time to achieve the solution. Also, the required optimization time is reduced substantially to achieve the best previous results. The statistical analysis also shows the efficacy of the proposed technique.

Module placement with boundary constraints using O-tree representation

A Fast OPC Algorithm for IC Layout Based on 1-D Cells after Optimization of Gap Distribution

Layout Optimization of Truss Structures with Modular Constraints

Modern Floorplanning with Boundary Clustering Constraint

VLSI Floorplanning with Boundary Constraints Based on Corner Block List

A new representation in 3D VLSI floorplan: 3D O-Tree

A Packing Algorithm for Non-Manhattan Hexagon/triangle Placement Design by Using an Adaptive O-tree Representation

Spanning graph-based nonrectilinear steiner tree algorithms

A New Timing-Driven Placement Algorithm Based on Table-Lookup Delay Model

Vlsi Floorplanning with Boundary Constraints Using Corner Block List Representation

Corner block list representation and its application with boundary constraints

Enhanced O-tree Algorithm for Obstacled Floorplanning

O.O: Optimized One-die Placement for Face-to-face Bonded 3D ICs

Timing-Driven Obstacle-Avoiding X-Architecture Steiner Minimum Tree Algorithm With Slack Constraints

Obstacle-Avoiding Rectilinear Minimum-Delay Steiner Tree Construction Towards Ip-Block-Based Soc Design

A Floorplanning Algorithm for Block Placement in SoC Design

Module Placement On Arbitrarily Rectilinear Regions Using Less Flexibility First Principles

A Heuristic Method for Module Sizing under Fixed-Outline Constraints

A Constraint-Based Placement Refinement Method For Cmos Analog Cell Layout

Floorplanning with Constraint Extraction Based on Interconnecting Information Analysis

Multilayer obstacle-avoiding x-architecture steiner minimal tree construction based on particle swarm optimization