Low temperature crystallization of atomic-layer-deposited SrTiO 3 films with an extremely low equivalent oxide thickness of sub-0.4 nm
Hong Keun Chung,Jihoon Jeon,Han Kim,Myoungsu Jang,Sung-Chul Kim,Sung Ok Won,In-Hwan Baek,Yoon Jang Chung,Jeong Hwan Han,Sung Haeng Cho,Tae Joo Park,Seong Keun Kim
DOI: https://doi.org/10.1016/j.apsusc.2024.160243
IF: 6.7
2024-05-12
Applied Surface Science
Abstract:Despite SrTiO 3 (STO) possessing a high dielectric constant, its application as a capacitor dielectric in dynamic random-access memory(DRAM) capacitors faces challenges due to the high-temperature annealing for crystallization, its compositional inhomogeneity, and the high leakage currents of STO films. To address these issues, we employ atomic layer deposition(ALD) of STO films onto Pt substrates at elevated temperatures(340–380 °C). The use of low-reactivity Pt electrodes effectively mitigates the initial growth of excess Sr, ensuring enhanced compositional uniformity along the film growth direction. Coupled with ALD at high temperatures, this approach facilitates the crystallization of STO films in the as-grown state, further enhancing the crystallinity with increasing film thickness. Subsequent low-temperature post-deposition annealing (PDA) at 400 and 500 °C achieves full crystallization. This process results in a remarkable increase in the dielectric constant, reaching approximately 150. Furthermore, the absence of microcracks after PDA, attributed to the formation of adequately dense films, contributes to substantially improved dielectric properties. Consequently, these STO films exhibit an exceptionally low equivalent oxide thickness of 0.34 nm coupled with an ultralow leakage current of 3.7 × 10 −8 A/cm 2 at an operation voltage of 0.8 V, promising for advancing DRAM capacitors. This study presents a pathway for the sustainable scaling of DRAMs, addressing challenges in ALD-grown STO films.
materials science, coatings & films,physics, applied,chemistry, physical, condensed matter