Abstract:Three-dimensional integrated circuits (3D ICs) make use of the vertical dimension for smaller footprint, higher speed, lower power consumption, and better timing performance. In 3D ICs, the inter-tier-via (ITV) is a critical enabling technique because it forms vertical signal and power paths. Accordingly, it is imperative to accurately and efficiently extract the electrostatic capacitances of ITVs using field solvers. Unfortunately, the cylindrical via shape presents major challenges to most of the existing methods. To address this issue, we develop a novel floating random walk (FRW) method by rotating the transition cube to suit the cylindrical surface and devising a special space management technique. Experiments on typical ITV structures suggest that the proposed techniques can accelerate the existing FRW and boundary element method (BEM) based algorithms by up to 20X and 180X, respectively, without loss of accuracy. In addition, compared with the naïve square approximation approach, our techniques can reduce the error by 10X. Large and multi-dielectric structures have been tested to demonstrate the versatility of the proposed techniques.

Extraction of Via-Plate Capacitance of an Eccentric Via by an Integral Approximation Method

EMC ’ 09 / Kyoto Calculation of the Via-Plate Capacitance of a Via with Pad Using Finite Difference Method for Signal / Power Integrity Analysis

Analytical Formulas for the Barrel-Plate and Pad-Plate Capacitance in the Physics-Based Via Circuit Model for Signal Integrity Analysis of PCBs

Capacitance Extraction of Three-Dimensional Interconnects Using Element-By-Element Finite Element Method (Ebe-Fem) and Preconditioned Conjugate Gradient (pcg) Technique

Capacitance extraction of high-density 3D interconnects using finite element method

Electrothermal modeling of coaxial through silicon via (TSV) for three-dimensional ICs

A New Model Library Approach to Extract VLSI Interconnect Capacitance

A New Via Chain Design Method Considering Confidence Level and Estimation Precision

Modeling of a Pair of Annular Through Silicon Vias (TSV)

A Physics-Aware Methodology for Equivalent Circuit Model Extraction of TSV-inductors

Compact Wideband Equivalent-Circuit Model for Electrical Modeling of Through-Silicon Via

Capacitance extraction of on-chip circular stacked inductors

Analytical extraction of via-via inductance by using SMM for power-ground planes

New circuit model for modeling differential pair of through-hole vias in multilayered electronic packages

Systematic Microwave Network Analysis for Multilayer Printed Circuit Boards with Vias and Decoupling Capacitors

Analytical Model of the Coupling Capacitance Between Cylindrical Through Silicon Via and Horizontal Interconnect in 3D IC.

A Semi-Analytical Approach for System-Level Electrical Modeling of Electronic Packages with Large Number of Vias

PI-EMI co-analysis of ground via effect

An Efficient Method for Comprehensive Modeling and Parasitic Extraction of Cylindrical Through-Silicon Vias in 3d Ics

Analyzing Multiple Vias in a Parallel-Plate Pair Based on a Nonorthogonal PEEC Method

Random Walk Based Capacitance Extraction for 3D ICs with Cylindrical Inter-Tier-vias