Abstract:The paper presents the development of a coupled scattering matrix method (SMM) with integral equation method for analyzing the power integrity (PI) of multilayered package structure with large number of power/ground vias. Analysis of the entire signal traces and the associated vias, connected between the power and ground, (named as P/G vias) is treated as analyzing the coupling between the external signal traces and the inside vertical vias, and analyzing the scattering effects between the vertical vias. A pair of the layered power/ground planes is considered as the parallel-plate waveguide structure. The scattering matrix method for the parallel-plate waveguide modes is developed by using the Foldy-Lax equations to analyze the scattering effects between the vertical P/G vias. The equivalent layered vias are modeled for the vertical vias connected between the power/grounds planes. The scattering matrices for coupling between the P/G vias including the signal vias are computed, and hence the outgoing wave coefficients for each via are calculated for power integrity analysis. The admittance (Y) matrix of a two-port network is modeled to represent the multiple scattering of the vertical P/G vias with the signal vias. The integral equation method is used to extract the equivalent circuit models for coupling between the external signal traces and the vertical vias. The extracted models are simulated together with the Y-matrix for signal response.

Analytical extraction of via-via inductance by using SMM for power-ground planes

Hybrid of Scattering Matrix Method and Integral Equation Used for Co-simulation of Power Integrity and EMI in Electronic Package with Large Number of P/G Vias

Novel Co-Simulation Method for Analysis of Power Integrity and EMI in Electronic Packages with Large Number of Power/ground Vias

Efficient Analysis for Multilayer Power-Ground Planes with Multiple Vias and Signal Traces in an Advanced Electronic Package

PI-EMI co-analysis of ground via effect

Systematic Microwave Network Analysis for Multilayer Printed Circuit Boards with Vias and Decoupling Capacitors

A Semi-Analytical Approach for System-Level Electrical Modeling of Electronic Packages with Large Number of Vias

A Novel Hybrid Analytical Method for Impedance Calculation of Power and Ground Planes

Modeling of Advanced Multilayered Packages with Multiple Vias and Finite Ground Planes

Hybridization of the Scattering Matrix Method and Modal Decomposition for Analysis of Signal Traces in a Power Distribution Network

Extraction of Equivalent Network of Arbitrarily Shaped Power-Ground Planes with Narrow Slots Using a Novel Integral Equation Method

An Efficient Method for Power Integrity and EMI Analysis of Irregular-Shaped Power/Ground Planes in Packages

An Efficient Approach for the Power/ground Plane Equivalent Circuit Extraction

In-package P/G Planes Analysis and Optimization Based on Transmission Matrix Method

Modeling Multilayer Power/ground Planes in Printed Circuit Boards and Electronic Packages Using Microwave Networks

Analysis of Multiple Vias Coupling in Silicon Interposer by Using Cylindrical Mode Expansion Method

Emission and Susceptibility Modeling of Finite-Size Power-Ground Planes Using a Hybrid Integral Equation Method

Analytical Formulas for the Barrel-Plate and Pad-Plate Capacitance in the Physics-Based Via Circuit Model for Signal Integrity Analysis of PCBs

Analysis of Smt Decoupling Capacitor Placement in Electronic Packages Using Hybrid Modeling Method

A novel method for low impedance design of power and ground planes

A new hybrid field-circuit approach to model the powerground planes with narrow slots