Abstract:In order to solve the problem of high cost of chip testing in the process of Three-Dimensional (3D) chip manufacturing,a new scheduling method based on Time Division Multiplexing (TDM) was proposed to optimize the testing resources between layers,layer and core cooperatively.Firstly,the shift registers were arranged on each layer of 3D chip,and the testing frequency was divided properly between the layers and cores of the same layer under the control of shift register group on input data,so that the cores in different locations could be tested in parallel.Secondly,greedy algorithm was used to optimize the allocation of registers for reducing the free test cycles of core parallel test.Finally,Discrete Binary Particle Swarm Optimization (DBPSO) algorithm was used to find out the best 3D stack layout,so that the transmission potential of the Through Silicon Via (TSV) could be adequately used to improve the parallel testing efficiency and reduce the testing time.The experimental results show that,under the power constraints,the utilization rate of the optimized whole Test Access Mechanism (TAM) is increased by an average of 16.28％,and the testing time of the optimized 3D stack is reduced by an average of 13.98％.The proposed method can decrease the time and reduce the cost of testing.

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