Abstract:In this work, in order to investigate the effect of TiO2 layer on the microstructure and piezoelectric properties of (Na0.85K0.15)(0.5)Bi0.5TiO3 (NKBT) thin films, TiO2 layer was inserted at the interface between the NKBT thin film and substrate and on both sides of the NKBT, i.e., at the interface and on the top of the NKBT thin film. NKBT composited films with alternative TiO2 layer were deposited on Pt/Ti/SiO2/Si substrate by aqueous sol-gel method. X-ray diffraction observation found that the degree of (100) preferred orientation strengthened with TiO2 layers added, especially on both sides of NKBT thin film. The TiO2/NKBT/TiO2 composited film with both TiO2 layer of 40nm thickness exhibited a remnant polarization value P-r of 22.6c/cm(3) and effective piezoelectric coefficient d*(33) of approximate 77pm/V, which are much larger than that of the single-layered NKBT thin film with P-r value of 13.7 c/cm(3) and d*(33) of 56pm/V, respectively. According to the investigation of the temperature-dependent ferroelectric property, it was found that the P-r gradually increased, and in the meantime the coercive voltage gradually moved to higher voltage with testing temperature varied from 20 to -150 degrees C. Besides, applied voltage dependence of leakage current density measurement indicated that the TiO2 layer would effectively lower the leakage current of the films, and the TiO2/NKBT/TiO2 composited film both TiO2 layer of 40nm exhibited the lowest leakage current.

The Influence of the Thickness of Tio2 Seeding Layer on Structural and Electrical Properties of Bi3.15nd0.85ti3o12 Thin Films

Influence of the annealing temperature of the Bi4Ti3O12 seeding layer on the structural and electrical properties of Bi3.15Nd0.85Ti2.99Mn0.01O12 thin films

Structure and Electrical Properties of Trilayered BaTiO3/(Na0.5Bi0.5)TiO3–BaTiO3/BaTiO3 Thin Films Deposited on Si Substrate

Composition-Dependent Electrical Characteristics And Interface Microstructures Of Solution-Derived Nd-Substituted Bi4ti3o12 Thin Films On Pt Electrodes

Influence of the annealing temperature of the Bi<sub>4</sub>Ti<sub>3</sub>O<sub>12</sub> seeding layer on the structural and electrical properties of Bi<sub>3.15</sub>Nd<sub>0.85</sub>Ti<sub>2.99</sub>Mn<sub>0.01</sub>O<sub>12</sub> thin films

Improvement of Nucleation and Electrical Properties of Bi 3.15 Nd 0.85 Ti 2.99 Mn 0.01 O 12 Thin Films with an Upper Bi 4 Ti 3 O 12 Buffer Layer

Influence of Seed Layer on Crystal Orientation and Electrical Properties of (na0.85k0.15)0.5bi0.5tio3 Thin Films Prepared by a Sol–gel Process

Investigation of Thickness Dependence of Electric Properties of Sol-Gel Bnt-Bt Thin Films with Stepwise Crystallization

Microstructure And Ferroelectric Properties Of Sol-Gel Derived Bi3.15nd0.85ti3o12 Thin Films On Pt/Ti/Sio2/Si(100)

Enhanced Dielectric and Piezoelectric Properties in Lead-Free Bi0.5Na0.5TiO3–BaTiO3–SrTiO3 Thin Films with Seed Layer

STRUCTURE AND PROPERTIES OF Bi4-xNdxTi3O12 THIN FILMS PREPARED BY METAL-ORGANIC SOLUTION DEPOSITION

Thickness Dependent Dielectric and Piezoelectric Properties of BNT–BT–ST Thin Films

Microstructure and Electric Properties of (na0.85k0.15)(0.5)bi0.5tio3 Composited Films with Alternative Tio2 Layers

Structural, Ferroelectric, Dielectric Properties and Leakage Characteristics of Neodymium-Doped Bi 4 Ti 3 O 12 Thin Films Prepared by Metalorganic Deposition Method

Synthesis of Bi4-xNdxTi3O12 Thin Film by UV-Light Irradiation

Effects of Bi2O3 Seeding Layer on Crystallinity and Electrical Properties of CSD-derived Bi4−xLaxTi3O12 Ferroelectric Thin Films

Structural and optical properties of Bi4−xNdxTi3O12 thin films prepared by metal-organic solution deposition

Thickness Effect On (La0.26bi0.74)(2)Ti4o11 Thin-Film Composition And Electrical Properties

Electrical Properties of Chemical-Solution-derived Bi3.54Nd0.46Ti3O12 Ferroelectric Thin Films

Preparation and Properties of Bi 4 − x Nd x Ti 3 O 12 Thin Films by Chemical Solution Deposition

THE THICKNESS EFFECT OF BTO IN BTO/BLTZ0.20/BTO THIN FILMS PREPARED BY RF-MAGNETRON SPUTTERING