Abstract:Preparing high-quality AlN films at low temperatures is always highly demanded in plenty of application-fields, despite the high temperature is always necessary to enable the AlN crystallization. Therefore, improving the structural properties at low temperature is still challenging in the field. In the present work, the metal organic chemical vapor deposition (MOCVD) grown AlN nucleation layer is employed to improve the crystallinity and morphology of sputtered AlN on 6-inch Si (111) substrate at the temperature even as low as 100°C where it is not principally possible to achieve the crystallization of sputtered AlN. When compared with the as-sputtered AlN prepared even at 650°C, it is found that the full width at half maximum (FWHM) of AlN (002) X-ray rocking curves is intensively decreased to 0.96° from 1.61°, and such a reduction indicates that the screw dislocation density is decreased from 7.31×1010 down to 2.14×1010/cm2. In addition to the crystallinity, the morphology is also obviously improved that the root-mean-square (RMS) roughness is reduced from 4.99 nm down to 0.83 nm in a scanned area of 3×3 μm2 through introducing AlN nucleation. Therefore, such a combination highlights the contribution of AlN nucleation grown by MOCVD in improving the structural properties of low-temperature sputtered AlN layer which is compatible with the manufacturing of Si integrated circuits.

Metallization development for AIN/W cofired substrate at low temperature

Study on Tungsten Metallization and Interfacial Bonding of Silicon Nitride High-Temperature Co-Fired Ceramic Substrates

Low temperature cofired and multilayer substrates

Fabrication of nanocrystalline supersaturated W–Al alloys with enhanced thermal stability and high sinterability

A Silver‐palladium Thick Film for Aluminum Nitride Substrate

Effects of High-Temperature Treatment on the Reaction Between Sn-3%Ag-0.5%Cu Solder and Sputtered Ni-V Film on Ferrite Substrate

Interfacial Defects in AlN/W Cofired Substrates

Study of the Ag-Pd thick film conductor for AlN substrate metallization

Tape-casting fabrication of low-temperature sintering-AlN substrate with high thermal conductivity

The Research Of Al/Aln And Al/Al2o3 Substrate

Microstructure of low-temperature sintered AlN

Microstructure and mechanical property of thick Cu/AlN joints formed at low temperature

Effects of Oxide Additives on Sheet Resistance of W Thick-Film Conductor

The study and fabrication of Al/AlN substrate

Transient Liquid-Phase Sintering And Thermal Conductivity Of Ain

Low Temperature Sintering and Performance of Aluminum Nitride/Borosilicate Glass

Balancing thermal conductivity and strength of hot-pressed AlN ceramics via pre-sintering and annealing process

Cu Metallization of LTCC Substrate by Co-Firing Process in N2 Atmosphere

Improving the structural performance of low-temperature sputtered AlN on silicon substrate

Ti Metallization of AIN Surface by Molten Salt Reaction

Two-step Burnout Technique and Low-Temperature Cofiring of Multilayer Aluminum Nitride Substrates