Abstract:With the dramatic requirements of high power and high integrity in field of power devices, the study of novel interconnection materials and packaging methods has been paid an extremely attention. Presently, the most candidates for the chip bonding are Zn-based, Bi-based, noble-metal-based (such as Au-Sn, Au-Ge, Au-Si), nano-metal particles (Ag or Cu nanoparticles) and transient-liquid-phase (TLP) bonding. However, a high bonding temperature and poor ductility for Zn-based solder (more than 420°C) causing irreversible damages or accelerated aging affects to the electronic devices; Bi-based solder alloys are still under way mainly due to their inferior thermal and electrical conductivity as well as poor workability; It's worth noting that nano-silver sintering and TLP bonding technology have been proven to be the potential solutions to the power electronic packaging, because their processing temperatures are relatively low and the produced joints are of high re-melting temperatures. However, Ag is expensive and easy to electromigration, which will influence the stability/reliability of the joints and hinder to universal industry applications. For the TLP bonding, the process to produce full intermetallic compounds (IMCs) is time-consuming, commonly more than 60 min, due to relatively low reaction velocity. To solve the problem of time-consuming of the TLP, an enhanced and low-cost auxiliary energy is necessary. Ultrasonic-assisted soldering has been proven able to solder dissimilar metals at low temperatures within a very short time. In our previous work, a full Cu6Sn5/Cu3Sn IMCs joint through TLP assisted by ultrasound was obtained. Because of the acoustic cavitation and streaming effect created by ultrasonic waves propagating in molten alloys, the atom diffusion and physical-chemical interactions were accelerated at the liquid/solid interfaces. However, a sole IMC joint with single phase has not been fabricated so far. High re-melting temperature joint consisted of nearly sole Ni 3 Sn 4 with a high shear strength of 43.4 MPa was achieved with Sn-24 wt.%Ni by ultrasonic-assisted soldering for 10 s. This rapidly formed intermetallic joint was phase-stable as isothermally aged at 300 °C for 72 h in air and its shear strength was 33.4 MPa due to the Ni 3 Sn 4 grains coarsening. These results demonstrate that the less time-consuming ultrasonic-assisted soldering has wide potentials for high-temperature power electronic packaging.

Microstructure and mechanical property of thick Cu/AlN joints formed at low temperature

Microstructure Evolution Mechanism and Mechanical Properties of AlNP/Al Composites Bonded to 6061al at Low Temperature

Ultrasonic-assisted wetting and soldering of AlN ceramic by using a nonactive solder (Sn9Zn) in air

Effect of Sn element on the interfacial reinforced AlN/Cu joint brazed by Ag–Cu–Ti–(Snx) filler

Interfacial Microstructure Evolution and Mechanical Properties of Al/Sn Joints by Ultrasonic-Assisted Soldering

Ultrasonic-assisted liquid phase diffusion bonding of Al alloys under low temperature and pressure for high-temperature resistance applications

Shear Properties of Low-Temperature Soldered Joints of Aluminum Nitride Metallized with Sn-1.0ag-0.5cu-Ti Alloys

Low-temperature joining of alumina ceramic and nickel by Al-Ni self-propagating nanofoil

Low and Cryogenic Temperature Mechanical Performance and Fracture Behavior of Micro-Scale Cu/Sn–3.0Ag–0.5Cu/Cu Joints with the Decreasing Dimension

Dissimilar Copper-Aluminum Joint Processed by Low-Temperature Nickel Electroplating

Sn-enhanced high-temperature reliability of Cu/Nano-Ag/Cu joint via transient-liquid-phase bonding

Rapid Formation of Intermetallic Joints with Sn/metal Composite Alloys by Ultrasonic-Assisted Soldering for High-Temperature Chip Attachment

Mechanical and Heat Transfer Properties of AlN/Cu Joints Based on Nanosecond Laser-Induced Metallization

Low Temperature Al Based Wafer Bonding Using Sn As Intermediate Layer

Effect of CuZnAl Particles Addition on Microstructure of Cu/Sn58Bi/Cu TLP Bonding Solder Joints

Ultrasonic-assisted Soldering of Sn-based Solder Alloys to Form Intermetallic Interconnects for High Temperature Application

Low-temperature Solid State Bonding Method Based on Surface Cu–Ni Alloying Microcones

Solderless Bonding with Nanoporous Copper As Interlayer for High-Temperature Applications.

Die-attach Bonding at 230 °C Using Micron Sn-coated Zn Particles for High-Temperature Applications

Formation mechanism and mechanical performance of ultrasonic-assisted soldered joints of SiC p /2024Al composites at low temperature

Low-temperature Ultrasound-Activated Joining of ZrO2 Ceramics Using Sn-Al-Cu Solder