Ultrasonic-assisted transient liquid phase bonding of SiC ceramic and aluminum alloy using an inactive Zn interlayer
Di Zhao,Wenkang Du,Ziyang Xiu,Jiuchun Yan
DOI: https://doi.org/10.1016/j.matchar.2023.112902
IF: 4.537
2023-04-14
Materials Characterization
Abstract:It is very challenging to diffusion-bond ceramic and aluminum alloys using an inactive interlayer. In this work, the joining of SiC ceramic and aluminum alloys was performed by using ultrasonic-assisted transient liquid phase (TLP) bonding with an inactive interlayer of pure Zn. The TLP bonded joints of SiC/Al are composed of four layers: Zn diffusion, ZnAl eutectic, ZnAl eutectoid, and SiC/bond-metal interfacial layer. With the prolonging of ultrasonic action time, the ZnAl eutectoid layer thickened and ZnAl eutectic layer thinned gradually, and the partial bonding interface of SiC/bond-metal evolved into the full bonding interface. The shear strength and thermal conductivity of the SiC/Al joints increased by the ultrasonic applied within 5 s, depending on the increasing SiC/bond-metal interface bonding ratio. As the ultrasonic acting time is over 5 s, the SiC/Al joints properties increased because of the increasing proportion of ZnAl eutectoid microstructure with better plasticity and lower thermal resistance. It was revealed that the bond metal transformed from an inactive Zn to an active ZnAl alloy with the aid of the dissolution of Al under the action of ultrasounds, and an amorphous Al 2 O 3 transition layer with a thickness of ∼20 nm was formed at the SiC/bond-metal interface.
materials science, multidisciplinary,metallurgy & metallurgical engineering, characterization & testing