Application of Ultrasonic Power in Forming Sn58Bi/Cu Solder Joints with Trace Si3N4 Nanowire Doping
Chen Chen,Liang Zhang,Mo Chen,Xi Huang,Chuan-jiang Wu
DOI: https://doi.org/10.1007/s11665-024-09514-3
IF: 2.3
2024-05-09
Journal of Materials Engineering and Performance
Abstract:Incorporating trace amounts of Si 3 N 4 nanowires for modification, ultrasound was applied to assist in the high-quality formation of Sn58Bi/Cu solder joints. The influence of ultrasound power intensity on the solder alloy, wetting behavior, as well as the microstructure, interfacial intermetallic compounds (IMCs), and mechanical performance of the solder joints was investigated. The results revealed that the ultrasonic cavitation altered the crystal structure of the alloy, refining its matrix structure, increasing the spreading area of the molten solder on the Cu substrate, and reducing the wetting angle. Simultaneously, the ultrasonic action effectively refined the microstructure in solder joint and reduced the interfacial IMC thickness and its grains size. The solder alloy microhardness was enhanced slightly, and the lap joint shear strength was increased, with the appearance of rare ductile features in the fracture surface. The ultrasonic cavitation significantly promoted the elements to diffuse and refined various phases, and the strengthening effect became increasingly pronounced with appropriately increasing ultrasonic power. The primary objective of this study is to further elevate the solder joints performance, concurrently delivering valuable insights to facilitate advancements in the research and applications of this promising technology.
materials science, multidisciplinary