Abstract:In this study, two types of blended alloys were processed by plasma transferred arc (PTA) hardfacing to form coatings. In the first case, a pre-alloyed Cu-Sn alloy and a pre-alloyed Co-base alloy were blended at a weight ratio of 85:15 (Cu-Sn/Co-base). In the second case, the pre-alloyed Cu-Sn and Co-base alloys were mixed with the molybdenum (Mo) element at a weight ratio of 81:15:4 (Cu-Sn/Co-base/Mo). Metastable liquid phase separation formed in the Cu-Sn/Co-base and Cu-Sn/Co-base/Mo coatings. The Co-rich spheroids as the minor precipitating alloy particles distributed on the Cu-rich matrix. The Co-rich spheroids consisted of α(Co) and M7C3 phases, and the Cu-rich matrix included α(Cu, Sn) and Cu10Sn3 phases. The relative content of α(Co)+M7C3 phases in the Cu-Sn/Co-base/Mo coating was higher than that in the Cu-Sn/Co-base coating. The numbers of the Co-rich spheroids in the cross section of the Cu-Sn/Co-base coating increased with increasing the distance from the substrate, and an obvious macroscopic segregation could be found in the coating close to its substrate. When Mo as additive was further added, the numbers of the Co-rich spheroids in the cross section of the coating increased and the macroscopic segregation could not be seen when compared to that in the Cu-Sn/Co-base coating. The wear rate of the Cu-Sn/Co-base and Cu-Sn/Co-base/Mo coatings was lower than that of the Cu-Sn coating, and a distinct improvement of the wear rate could be obtained in the Cu-Su/Co-base/Mo coating, attributing to mainly the increasing hardness of the coatings by sequence of the Cu-Sn coating, Cu-Sn/Co-base coating, and Cu-Sn/Co-base/Mo coating. The friction coefficient of the coatings has an increasing trend by sequence of the Cu-Sn coating, Cu-Sn/Co-base coating, and Cu-Sn/Co-base/Mo coating, but an obvious difference could not be seen in the coatings.

Wetting Behavior and Interfacial Characteristics in the Molten Bi-Sn/High-Entropy Alloy System

Reactive wetting between molten Sn-Bi and Ni substrate

Interface microstructures in the wetting of Cu by equiatomic GaInSnBiZn high-entropy alloy

Spreading Dynamics and Interfacial Characteristics of Sn-3.0Ag-0.5Cu-xBi Melting on Cu Substrates

Study on the metallurgical reaction law and mechanism of the Ni-xCu alloys/pure Sn solid-liquid interface

Wetting Behaviors and Interfacial Reaction Between Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu Substrate

Influence of Porous High Entropy Alloy Coating on Wetting Behavior and Interfacial Microstructure of Al-Si Alloy on Steel Substrate

Wetting Behaviors of Pure Nickel and Nickel-Based Alloys on Sintered ZrB2-SiC Ceramics

Sn behavior over Si_3N_4/2024Al composite surface in wetting test of Sn-Zn alloy

Interfacial Reactions of Sn-8wt.%Zn-3wt.%Bi Solder with Cu, Ag, and Ni Substrates

Wettability and spreading behavior of Sn–Cr alloys on SiC

Evaluation of Solidification and Interfacial Reaction of Sn-Bi and Sn-Bi-In Solder Alloys in Copper and Nickel Interfaces

The wetting behavior of Al/Sn under ultrasonic action

Phase equilibria and wetting of Al–Co–Cu and Al–Co–Ni quasicrystals

Liquid Phase Separation Microstructure and Properties of Mixed Cu-Sn and Co-Base Alloys Without or with Molybdenum Addition Processed by Plasma Transferred Arc Hardfacing

Wetting and Interfacial Chemistry of New Pb-Free Sn-Zn-Ag-Al-Li (SZAAL) Solder with Cu, Ni, and Al Substrates

Reactive Wetting of Eutectic Sn3.8Ag0.7Cu Solder on Electrodeposited Fe-Ni Alloy Layer

Effect of Sn addition on the tribological behaviors of CoCrFeNi high entropy alloys

Interfacial Reaction Between Novel High Entropy Alloy SnPbInBiSb and Cu Substrate

Molecular dynamics and first-principles calculations on the wetting behavior and mechanism of molten Al on nickel-infiltrated steel: A cross-scale simulation

Effect of Sn element on the interfacial reinforced AlN/Cu joint brazed by Ag–Cu–Ti–(Snx) filler