Abstract:AbstractIn order to identify the effect on the properties and behavior of tin–zinc–bismuth (Sn-8 wt% Zn-3 wt% Bi or Sn-13.6 at.% Zn-1.6 at.% Bi) based solders produced by adding nickel (Ni) nano-particles, the interfacial microstructure between plain and composite solders with newly developed immersion silver (Ag) plated copper (Cu) substrates has been investigated as a function of reaction time, at various temperatures. For plain Sn–8Zn–3Bi solder joints, a scallop-shaped Cu–Zn–Ag intermetallic compound layer was found to adhere to the surface of the immersion Ag-plated Cu substrate. However, after addition of Ni nano-particles into the Sn–8Zn–3Bi solder, Cu–Zn–Ag (at the bottom) and (Cu, Ni)–Zn (at the top) intermetallic compound layers were observed at the interfaces. In addition, these intermetallic compound layer thicknesses increased substantially with increases in the temperature and reaction time. In the solder ball region, needle-shaped α-Zn rich phase and spherically-shaped Bi-particles appeared to be homogeneously distributed throughout a beta-tin (β-Sn) matrix. However, after the addition of Ni nano-particles, needle-shaped α-Zn rich phase appeared that exhibited a fine microstructure, due to the heterogeneous nucleation of the Ni nano-particles. The calculated activation energy for the Cu–Zn–Ag intermetallic compound layer for the plain Sn–8Zn–3Bi solder/immersion Ag-plated Cu system was 29.95 kJ/mol—while the activation energy for the total [Cu–Zn–Ag + (Cu, Ni)–Zn] intermetallic compound layers formed in the Sn–8Zn–3Bi–0.5Ni (Sn-13.6 at.% Zn-1.6 at.% Bi ~1 at.% Ni) composite solder/immersion Ag-plated Cu system was 27.95 kJ/mol. Addition of Ni nano-particles reduces the activation energy which enhanced the reaction rate as we know that lower the activation energy indicates faster the reaction rate.

Interfacial Reactions of Sn-8wt.%Zn-3wt.%Bi Solder with Cu, Ag, and Ni Substrates

Interfacial reactions in the Sn–9Zn–( x Cu)/Cu and Sn–9Zn–( x Cu)/Ni couples

Interfacial reactions in the Sn–9Zn–(<i>x</i>Cu)/Cu and Sn–9Zn–(<i>x</i>Cu)/Ni couples

Solid-state reactions between Sn-20.0 wt.%In- x wt.%Zn solders and Ag and Ni substrates

Interfacial reactions in the Sn–In–Zn/Ag and Sn–In–Zn/Ni couples

Interfacial Reactions in the Sn–20 At.% In/Cu and Sn–20 At.% In/Ni Couples at 160 °C

Interfacial Reactions in Sn-Pb/Ni-8.0 at.%V Couples

Sn–0.7wt.%Cu/Ni Interfacial Reactions at 250°C

Evaluation of Solidification and Interfacial Reaction of Sn-Bi and Sn-Bi-In Solder Alloys in Copper and Nickel Interfaces

Interfacial Reactions in Sn–20In–2.8Ag/Cu Couples

Spreading Dynamics and Interfacial Characteristics of Sn-3.0Ag-0.5Cu-xBi Melting on Cu Substrates

Effects of Bi and Cu addition on mechanical properties of Sn9Zn alloy and interfacial intermetallic growth with Ni substrate

Interfacial Reaction of Sn–2.0Ag–2.5Zn Solder on Cu and Ni–W Substrates

Interfacial Reactions And Reliability Of Sn-Zn-Bi-Xcr Solder Joints With Cu Pads

Formation and Growth of Interfacial Intermetallic Layers of Sn-8Zn-3Bi-0.3Cr on Cu, Ni and Ni-W Substrates

Physical Properties of the Sn-Ag-Cu-In-X (Zn,Bi) Solder alloys

Interfacial reactions in the Sn–Sb/Ag and Sn–Sb/Cu couples

Thermal Property, Wettability and Interfacial Characterization of Novel Sn–Zn–Bi–In Alloys As Low-Temperature Lead-Free Solders

Microstructure and kinetic analysis of the properties and behavior of nickel (Ni) nano-particle doped tin–zinc–bismuth (Sn–8Zn–3Bi) solders on immersion silver (Ag)-plated copper (Cu) substrates

Interfacial Reactions in Sn-0.7wt.%Cu/Ni-V Couples at 250°C

Wetting and Interfacial Chemistry of New Pb-Free Sn-Zn-Ag-Al-Li (SZAAL) Solder with Cu, Ni, and Al Substrates