Abstract:With the dramatic requirements of high power and high integrity in field of power devices, the study of novel interconnection materials and packaging methods has been paid an extremely attention. Presently, the most candidates for the chip bonding are Zn-based, Bi-based, noble-metal-based (such as Au-Sn, Au-Ge, Au-Si), nano-metal particles (Ag or Cu nanoparticles) and transient-liquid-phase (TLP) bonding. However, a high bonding temperature and poor ductility for Zn-based solder (more than 420°C) causing irreversible damages or accelerated aging affects to the electronic devices; Bi-based solder alloys are still under way mainly due to their inferior thermal and electrical conductivity as well as poor workability; It's worth noting that nano-silver sintering and TLP bonding technology have been proven to be the potential solutions to the power electronic packaging, because their processing temperatures are relatively low and the produced joints are of high re-melting temperatures. However, Ag is expensive and easy to electromigration, which will influence the stability/reliability of the joints and hinder to universal industry applications. For the TLP bonding, the process to produce full intermetallic compounds (IMCs) is time-consuming, commonly more than 60 min, due to relatively low reaction velocity. To solve the problem of time-consuming of the TLP, an enhanced and low-cost auxiliary energy is necessary. Ultrasonic-assisted soldering has been proven able to solder dissimilar metals at low temperatures within a very short time. In our previous work, a full Cu6Sn5/Cu3Sn IMCs joint through TLP assisted by ultrasound was obtained. Because of the acoustic cavitation and streaming effect created by ultrasonic waves propagating in molten alloys, the atom diffusion and physical-chemical interactions were accelerated at the liquid/solid interfaces. However, a sole IMC joint with single phase has not been fabricated so far. High re-melting temperature joint consisted of nearly sole Ni 3 Sn 4 with a high shear strength of 43.4 MPa was achieved with Sn-24 wt.%Ni by ultrasonic-assisted soldering for 10 s. This rapidly formed intermetallic joint was phase-stable as isothermally aged at 300 °C for 72 h in air and its shear strength was 33.4 MPa due to the Ni 3 Sn 4 grains coarsening. These results demonstrate that the less time-consuming ultrasonic-assisted soldering has wide potentials for high-temperature power electronic packaging.

Rapid Ultrasonic-Assisted Soldering of AZ31B Mg Alloy/6061 Al Alloy with Low-Melting-Point Sn–xZn Solders Without Flux in Air

Ultrasonic-assisted Soldering of Fine-Grained 7034 Aluminum Alloy Using Sn-Zn Solders below 300°C.

Avoiding degradation and increasing joint strength of Al alloys by rapid ultrasonic soldering at low temperature

Ultrasonic-assisted fluxless reactive bonding of Mg/Al dissimilar alloy using Zn–Al solder in air

Ultrasonic Soldering Aluminum at Low Temperature

Ultrasonic-assisted Soldering of Fine-Grained 7034 Aluminum Alloys Using ZnAl Filler Metals

Ultrasonic-assisted Soldering W90 Tungsten Heavy Alloy to AZ31B Mg Alloy Using Sn-xAl Alloy

Ultrasonic Soldering Aluminum at Low Temperature Strength and elongation of soldered joints can be improved with tin-based solder containing zinc

Ultrasonic-assisted soldering of Mg alloy joints using Cu-foam/Sn composite solder foils

Control Al/Mg Intermetallic Compound Formation During Ultrasonic-Assisted Soldering Mg to Al.

Si Particulate-Reinforced ZnAl Based Composites Joints of Hypereutectic Al50Si Alloys by Ultrasonic-Assisted Soldering

Ultrasonic-assisted Soldering of Sapphire Through Metallic Transition Layers of Al and Zn Using Sn-xZn-2Al Solder Alloys

Ultrasonic-induced metallurgical bonding between W90 tungsten heavy alloy and AZ31B Mg alloy using Sn

Microstructure Evolution and Mechanical Properties of Ultrasonic-Assisted Soldering Joints of 2024 Aluminum Alloys

Joining Mg Alloys with Zn Interlayer by Novel Ultrasonic-Assisted Transient Liquid Phase Bonding Method in Air

Joining mechanism, microstructure, and mechanical properties of AZ31/6061 joint prepared by pouring fusion welding process assisted with Zn-xSn brazing filler

Rapid Formation of Intermetallic Joints with Sn/metal Composite Alloys by Ultrasonic-Assisted Soldering for High-Temperature Chip Attachment

Microstructure and Mechanical Properties of Ultrasound-Assisted Soldered Al-50 Wt.%si/al-27 Wt.%si Joints for Automotive Applications

Ultra-rapid Transient Liquid Phase Bonding of Mg Alloys Within 1 S in Air by Ultrasonic Assistance

Microstructure and Mechanical Properties of Ultrasonically Assisted Brazing of Dissimilar Cu–Al Alloys

Ultrasonic-assisted soldering of Sn-based alloys during die bonding for high-temperature application