Abstract:In order to achieve desired mechanical properties of alloys by manipulating grain boundaries (GBs) via solute decoration, it is of great significance to understand the underlying mechanisms of microstructural evolution and plastic deformation. In this work, nanocrystalline (NC) Cu-W alloyed films with W concentrations spanning from 0 to 40 at% were prepared by using magnetron sputtering. Thermal stability (within the temperature range of 200 °C-600 °C) and hardness of the films were investigated by using the x-ray diffraction, transmission electron microscope (TEM) and nanoindentation, respectively. The NC pure Cu film exhibited substantial grain growth upon all annealing temperatures. The Cu-W alloyed films, however, displayed distinct microstructural evolution that depended not only on the W concentration but also on the annealing temperature. At a low temperature of 200 °C, all the Cu-W alloyed films were highly stable, with unconspicuous change in grain sizes. At high temperatures of 400 °C and 600 °C, the microstructural evolution was greatly controlled by the W concentrations. The Cu-W films with low W concentration manifested abnormal grain growth (AGG), while the ones with high W concentrations showed phase separation. TEM observations unveiled that the AGG in the Cu-W alloyed thin films was rationalized by GB migration. Nanoindentation results showed that, although the hardness of both the as-deposited and annealed Cu-W alloyed thin films monotonically increased with W concentrations, a transition from annealing hardening to annealing softening was interestingly observed at the critical W addition of ∼25 at%. It was further revealed that an enhanced GB segregation associated with detwinning was responsible for the annealing hardening, while a reduced solid solution hardening for the annealing softening.

Interfacial Defects in AlN/W Cofired Substrates

Effect of Substrate Characteristics on Interdiffusion Coefficients of Ni and Al Atoms in Β-Nial Phase of Aluminide Coatings

Microstructure of low-temperature sintered AlN

Metallization development for AIN/W cofired substrate at low temperature

The W alloying effect on thermal stability and hardening of nanostructured Cu-W alloyed thin films

Influence of AlN(0001) Surface Reconstructions on the Wettability of an Al/AlN System: A First-Principle Study

Migration of Liquid Phase and Grain Growth in Low-Temperature Sintering of AlN

Low temperature cofired and multilayer substrates

Growth and Defects of AlN Epilayers by RF Molecular Beam Epitaxy

Study on Interfacial Reaction of Ti/AlN by SIMS, RBS and XRD

Interfacial Defects Related to the Substrate Treatment in Molecular Beam Epitaxial Silicon

Investigation of Interfacial Microstructures of TiN/AlN Multilayers by Neutron Reflectometry

Thermal-induced decomposition and mechanical properties of AlN/CrN superlattice coating

The study and fabrication of Al/AlN substrate

The Effect of Al Interlayers on the Growth of AlN on Si Substrates by Metal Organic Chemical Vapor Deposition

Evolution of the interfacial microstructure in 316L/Al x CoCrFeNi composite material induced by high-velocity impact welding

Interfacial Properties of AlN/Si (111) Grown by Metal-Organic Chemical Vapour Deposition

In situ infiltration behavior and interfacial microstructure evolution between Al and carbon fibers

Study on Tungsten Metallization and Interfacial Bonding of Silicon Nitride High-Temperature Co-Fired Ceramic Substrates

Interface reactions of an Ag/Cr/AlN sandwich during annealing between 250 and 650 °C

Formation and Precipitation Phases of Ni-Al System Intermetallic Surfacing Layers by Light Beam Heating