Effect of Copper Content and Substrate Bias on Structure and Mechanical Properties of Reactive Sputtered CrCuN Films

Shuyong Tan,Xuhai Zhang,Xiangjun Wu,Feng Fang,Jianqing Jiang
DOI: https://doi.org/10.1016/j.jallcom.2010.09.090
IF: 6.2
2011-01-01
Journal of Alloys and Compounds
Abstract:The CrCuN films with various Cu contents were deposited under different substrate bias by DC magnetron sputtering. The influence of Cu content and substrate bias was examined with regard to the microstructure, morphology, and mechanical properties of these films. The CrCuN films containing low Cu content (3.4at.%) present distinctive columnar growth. Their preferred orientations change from (111) (−50V bias) to (200) (−200V bias) and surface morphology changes from porous to granular structure with increasing bias. However, when the copper content is increased to 15at.%, CrCuN films remain (200) preferred growth independent of bias, while the film maximum hardness is reduced from 32GPa to 20GPa because of excess soft metal.
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