Abstract:Porous silicon (PSi) layers has been prepared in this work via photoelectrochemical (PEC) etching process of an n type silicon wafers of two resistivities (3.5 <a class="link-external link-http" href="http://ohm.cm" rel="external noopener nofollow">this http URL</a> and 0.02 <a class="link-external link-http" href="http://ohm.cm" rel="external noopener nofollow">this http URL</a>) in hydrofluoric (HF) acid of 24.5 precent concentration at different etching times (5 to 25 min). The irradiation has been achieved using laser beam of 2W power and 810 nm wavelength. We have studied the morphological and structural properties of PSi layers using the techniques of Xray Diffraction (XRD) and Scanning Electron Microscopy (SEM) and Gravimetric method. The Xray Diffraction data shows that the structure aspect of PSi layers remains crystalline as well as the decreasing of diffraction angle (thetaB) of Xray from PSi layers (29 to 26 degree) and increasing of the lattice parameter values of PSi structures with increasing of etching times from 5 to 25 min., and the resistivity of silicon substrates from 0.02 to 3.5 <a class="link-external link-http" href="http://ohm.cm" rel="external noopener nofollow">this http URL</a>. The nanocrystallite size is decreasing from (20.72 to 5.13 nm) with increasing of etching times, and the resistivity of silicon substrates. The SEM images shows that the values of pore width and PSi layer thickness increases from (0.5 to 6.25 micrometer) and (6.7 to 47 micrometer) respectively with increasing of etching times and silicon substrates resistivities, while the values of the thickness of walls between pores has been varied from (1.25 to 0.03 micrometer) with increasing of etching times and silicon substrates resistivities. The pore shape of pores has been varied from Cylindrical to Rectangular and to Starful with varied of etching conditions. Further the measured specific surface area of PSi layers has been increased from (7.43 to 235.35 m2/cm3) with increasing of etching times and silicon substrates resistivities.

Surface Microstructure of Porous Silicon Prepared by Electrochemical Etching

Electrochemically Prepared Porous Silver and Its Application in Surface-Enhanced Raman Scattering

Hydrogen Bubbles and Formation of Nanoporous Silicon During Electrochemical Etching

Photoluminescence, Composition and Microstructure of Porous Silicon Prepared by Different Substrates

Atomic Force Microscopic Studies of Light-Emitting Porous Silicon

Morphological and Electrical Features of Porous Silicon Prepared by Metal-Induced Chemical Etching

Morphological Aspects of Porous Silicon Prepared by Photoelectrochemical Etching

Reflectivity of porous-pyramids structured silicon surface

The Optical Properties of Porous Silicon Produced by Metal-Assisted Anodic Etching

Structural, Morphological and Electrical Properties of Porous Silicon Prepared Under Laser Illumination

Systematic Study on Pulse Parameters in Fabricating Porous Silicon-Layered Structures by Pulse Electrochemical Etching

Exploring the Influence of Solvents on Electrochemically Etched Porous Silicon Based on Photoluminescence and Surface Morphology Analysis

Microstructural characterisation of metallurgical grade porous silicon nanosponge particles

Al-assisted Anodic Etched Porous Silicon

Porous silicon formation and electropolishing

The Influence of Microstructure on Optical Properties of Porous Silicon

Optimization of Metal-Assisted Etchant Components for Fabrication of Porous Silicon

O:13a,13b, a new pathogenic serotype of Yersinia enterocolitica

Pulsed Anodic Etching: an Effective Method of Preparing Light-Emitting Porous Silicon

Study of Optical Properties of Porous Silicon Produced by Metal-Aid

Studies on microstructure and photoluminescence property of porous silicon