Si–Sb–Te films for phase-change random access memory

Baowei Qiao,Jie Feng,Yunfeng Lai,Yanfei Cai,Yinyin Lin,Ting-ao Tang,Bingchu Cai,Bomy Chen
DOI: https://doi.org/10.1088/0268-1242/21/8/016
IF: 2.048
2006-01-01
Semiconductor Science and Technology
Abstract:Electrical properties and crystallization behaviour of Si-Sb-Te films were studied and compared with those of a Ge2Sb2Te5 film. The resistivity ratio of Si-Sb-Te films can reach 106 during the amorphous-crystalline transition, accompanied with a small thickness change (less than 3%). The melting temperature of Si-Sb-Te films is lower than that of a Ge2Sb2Te5 film. Furthermore, the switching characteristics of the device using a Si10.7Sb39.5Te49.8 film were also studied. The device can be successfully switched with a 4 V, 100 ns pulse for SET operation and a 5 V, 40 ns pulse for RESET operation. A small RESET current and low power consumption can be obtained, which may be attributed to the low melting temperature and the high crystalline resistivity of Si-Sb-Te films. These results indicate the feasibility of Si-Sb-Te films in the application of phase-change random access memory.
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