Improvement of Electrical Properties of the Ge2sb2te5 Film by Doping Si for Phase-Change Random Access Memory

BW Qiao,J Feng,YF Lai,Y Ling,YY Lin,TA Tang,BC Cai,B Chen
DOI: https://doi.org/10.1088/0256-307x/23/1/050
2006-01-01
Chinese Physics Letters
Abstract:Si-doped Ge2Sb2Te5 films have been prepared by dc magnetron co-sputtering with Ge2Sb2Te5 and Si targets. The addition of Si in the Ge2Sb2Te5 film results in the increase of both crystallization temperature and phase-transition temperature from face-centred-cubic (fcc) phase to hexagonal (hex) phase. The resistivity of the Ge2Sb2Te5 film shows a significant increase with the Si doping. When doping 11.8 at.% of Si in the film, the resistivity after 460°C annealing increases from 1 to 11 mΩ.cm and dynamic resistance increase from 64 to 99Ω compared to the undoped Ge2Sb2Te5 film. This is very helpful to writing current reduction of phase-change random access memory.
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