MEMS Device for Quantitative in Situ Mechanical Testing in Electron Microscope
Xiaodong Wang,Shengcheng Mao,Jianfei Zhang,Zhipeng Li,Qingsong Deng,Jin Ning,Xudong Yang,Li Wang,Yuan Ji,Xiaochen Li,Yinong Liu,Ze Zhang,Xiaodong Han
DOI: https://doi.org/10.3390/mi8020031
IF: 3.4
2017-01-01
Micromachines
Abstract:In this work, we designed a micro-electromechanical systems (MEMS) device that allows simultaneous direct measurement of mechanical properties during deformation under external stress and characterization of the evolution of nanomaterial microstructure within a transmission electron microscope. This MEMS device makes it easy to establish the correlation between microstructure and mechanical properties of nanomaterials. The device uses piezoresistive sensors to measure the force and displacement of nanomaterials qualitatively, e.g., in wire and thin plate forms. The device has a theoretical displacement resolution of 0.19 nm and a force resolution of 2.1 μN. The device has a theoretical displacement range limit of 5.47 μm and a load range limit of 55.0 mN.