Reactive Ion Etching And Ion Beam Etching For Ferroelectric Memories

Tian-Qi Shao,Tian-Ling Ren,Li-Tian Liu,Jun Zhu,Zhi-Jian Li
DOI: https://doi.org/10.1080/10584580490459288
2004-01-01
Integrated Ferroelectrics
Abstract:The fabrication of the FeRAM requires the development of etching processes for ferroelectric thin films and electrodes as well as deposition processes. But different etching methods have different impacts such as resolution and process-induced damages. In this paper, reactive ion etching (RIE) and ion beam etching (IBE) for ferroelectric thin films and Pt electrodes have been studied in details. Different silicon-based ferroclectric thin films and their corresponding electrodes have been etched successfully. To compensate the possible oxygen loss caused by the etching process, the samples should be annealed in O-2 at 550degreesC for 30 min after RIE and IBE etching.
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