Negative bias temperature instability of HfN/HfO2 gated p-MOSFETs

Ning Sa,Kang Jin-Feng,Hong Yang,Xiaoyan Liu,Xing Zhang,Ruqi Han
DOI: https://doi.org/10.7498/aps.55.1419
IF: 0.906
2006-01-01
Acta Physica Sinica
Abstract:The negative-bias temperature instability (NBTI) characteristics of HfN/HfO2 gated p-MOSFET with equivalent oxide thickness (EOT) of 1.3 nm and low pre-existing traps are studied. Due to the low pre-existing trap density of HfN/HfO2 gate stack, the observed NBTI characteristics are intrinsic, rather induced by the fabricating process. The observed characteristics can be compared with those reported in SiO2 based gate stack and can be explained with the generalized reaction-diffusion (R-D) model: under negative bias and temperature stressing, holes injected from the Si substrate could cause the Si-H bond breaking at the Si substrate interface. The H atoms diffuse away into the bulk layer and the Si+ species are left at the interface. The diffusing H atoms and the left Si+ species cause the NBTI characteristics.
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